SPECIALTY MICROPROCESSOR CIRCUIT, CDFP24, CERPACK-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DFP, |
| Reach Compliance Code | unknown |
| JESD-30 code | R-GDFP-F24 |
| JESD-609 code | e0 |
| length | 15.4305 mm |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Maximum seat height | 2.286 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| 54F407FM | 54F407SDM | 54F407SDMQB | 74F407QC | 74F407DC | |
|---|---|---|---|---|---|
| Description | SPECIALTY MICROPROCESSOR CIRCUIT, CDFP24, CERPACK-24 | SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28 | SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24 |
| package instruction | DFP, | DIP, | DIP, | QCCJ, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-GDFP-F24 | R-GDIP-T24 | R-GDIP-T24 | S-PQCC-J28 | R-GDIP-T24 |
| Number of terminals | 24 | 24 | 24 | 28 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | DIP | DIP | QCCJ | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.286 mm | 5.715 mm | 5.715 mm | 4.57 mm | 4.572 mm |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible |
| Maker | Texas Instruments | - | - | Texas Instruments | Texas Instruments |
| JESD-609 code | e0 | e0 | - | e0 | e0 |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| width | - | 7.62 mm | 7.62 mm | 11.43 mm | 15.24 mm |
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