74F407DC datasheet, PDF - EEWORLD Datasheet

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74F407DC: DescriptionSPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24; CategoryThe embedded processor and controller Microcontrollers and processors; File Size334KB，7 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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74F407DC Overview

SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24

74F407DC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP,
Reach Compliance Code	unknown
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

74F407DC Related Products

	74F407DC	54F407SDM	54F407SDMQB	74F407QC	54F407FM
Description	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24	SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28	SPECIALTY MICROPROCESSOR CIRCUIT, CDFP24, CERPACK-24
package instruction	DIP,	DIP,	DIP,	QCCJ,	DFP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	S-PQCC-J28	R-GDFP-F24
Number of terminals	24	24	24	28	24
Maximum operating temperature	70 °C	125 °C	125 °C	70 °C	125 °C
Minimum operating temperature	-	-55 °C	-55 °C	-	-55 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	QCCJ	DFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	5.715 mm	5.715 mm	4.57 mm	2.286 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Base Number Matches	1	1	1	1	1
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible
Maker	Texas Instruments	-	-	Texas Instruments	Texas Instruments
JESD-609 code	e0	e0	-	e0	e0
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
width	15.24 mm	7.62 mm	7.62 mm	11.43 mm	-

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