SMT package using a NiPdAu plating to eliminate the
possibility of tin whiskering.
Functional Diagram
GND
4
1
2
GND
3
RF OUT
Applications
•
•
•
•
GSM, PCS, CDMA, WCDMA
Repeaters, BTS Transceivers
UHF
General Purpose
The WJA1010 consists of Darlington pair amplifiers using
a high reliability InGaP/GaAs HBT process technology.
The MMIC amplifier is internally matched to 50Ω and only
requires DC-blocking capacitors and an inductive RF choke
for operation. An internal active bias is designed to enable
stable performance over temperature. It also eliminates the
need for a dropping bias resistor and allows the device to
be biased directly from a +5V supply voltage.
The amplifier is targeted for high performance RF applications
in existing and next generation wireless technologies. In
addition, the WJA1010 will work for various other
applications within the 50 to 4000 MHz frequency range.
RF IN
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Specifications
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
Noise Figure
Device Voltage
Device Current
Typical Performance
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Min
50
Typ
900
14
11
10
+19.7
+39.7
4.9
5
83
Max
4000
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
(2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
14.5
-12
-13
+20
+40
4.7
Typical
900
14
-11
-10
+19.7
+39.7
4.9
1900
12
-8.1
-5.7
+16.8
+28.1
5.5
2140
11.7
-7.9
-5.4
+16.6
+27.5
5.7
1. Test conditions: 25 ºC, Supply Voltage = +5 V, 50
Ω
System.
2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
-40 to +85
°C
-55 to +150
°C
Ordering Information
Part No.
WJA1010
WJA1010-PCB
Rating
Description
+5V Active Bias InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
500 – 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 1 of 4
May 2007
WJA1010
+5V Active-Bias InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +5 V, I
cc
= 83 mA
1. Test conditions: T = 25 ºC, Supply Voltage = +5 V, Icc = 83 mA typical, 50
Ω
System.
2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Gain vs. Frequency
16
T=25°C
Return Loss
0
-5
40
T=25°C
OIP3 vs. Frequency
45
Pout=0 dBm/tone
14
S11, S22 (dB)
-10
-15
-20
-25
12
10
S11
S22
25
400
OIP3 (dBm)
Gain (dB)
35
30
+25C
3000
4000
600
-40C
+85C
1000
1200
8
0
1000
2000
Frequency (MHz)
3000
4000
0
1000
2000
Frequency (MHz)
T=25°C
800
Frequency (MHz)
Icc vs. Temperature
86
Vcc = +5V
Noise Figure vs. Frequency
6
16
Gain vs. Pout
f=900 MHz
84
5
14
82
4
80
3
78
-50
2
-25
0
25
50
Temperature (°C)
75
100
0
500
1000
1500
Frequency (MHz)
2000
2500
Gain (dB)
Icc (mA)
NF (dB)
12
10
8
10
12
14
16
Pout (dBm)
18
20
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 2 of 4
May 2007
WJA1010
Vcc = +5V
Icc = 83 mA
R4
0
Ω
+5V Active-Bias InGaP HBT Gain Block
Application Circuit
C3
Bypass
Capacitor
RF IN
R1
0
Ω
L1
RF Choke
RF OUT
WJA1010
C1
Blocking
Capacitor
R2
0
Ω
C2
Blocking
Capacitor
Recommended Component Values
(1)
Ref. Name
Value / Type
L1
39 nH wire wound inductor
C1, C2
56 pF chip capacitor
C3
0.018
μF
chip capacitor
R1, R2, R4
0
Ω
(2)
C4, C5, C6, Do Not Place
(2)
R3, R5, R6,
R7, R8
Size
0805
0603
0603
0603
1. The listed values are contained on the evaluation board to achieve optimal broadband performance
2. Place holders for the 0Ω resistors and “Do Not Place” references are not needed for final design.
Typical Device Data
S-Parameters (V
device
= +5 V, I
CC
= 83 mA, T = 25
°C,
calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
10
50
100
300
500
700
900
1100
1300
1500
1700
1900
2100
2300
2500
2700
2900
3100
3300
3500
3700
3900
4100
4300
4500
-12.56
-12.53
-12.53
-12.36
-12.18
-11.47
-10.72
-9.84
-9.05
-8.53
-8.33
-8.15
-7.89
-7.61
-7.29
-6.95
-7.01
-7.19
-7.39
-7.71
-7.93
-7.98
-8.52
-9.35
-10.54
-65.63
-145.62
-163.08
-175.50
179.61
173.33
168.38
162.56
155.70
148.56
139.78
130.22
122.73
114.31
107.47
99.88
91.90
83.16
75.46
68.81
63.54
58.22
50.35
42.18
36.78
19.04
15.64
15.03
14.73
14.52
14.42
14.07
13.80
13.44
13.01
12.56
12.20
11.81
11.39
11.00
10.49
9.94
9.39
9.02
8.72
8.44
8.02
7.41
6.81
6.44
166.11
164.55
166.78
158.79
147.29
135.23
123.91
111.77
100.58
89.52
79.14
69.11
58.89
48.15
38.03
27.54
18.02
9.85
1.31
-6.90
-17.30
-27.46
-38.42
-47.79
-56.41
-22.03
-19.28
-19.00
-18.95
-18.85
-18.72
-18.70
-18.61
-18.61
-18.50
-18.53
-18.56
-18.55
-18.56
-18.73
-18.83
-19.08
-19.14
-19.02
-18.97
-18.73
-18.69
-18.58
-18.50
-18.10
19.39
7.78
3.11
-2.26
-5.94
-9.12
-13.15
-16.57
-21.06
-24.91
-28.71
-32.58
-35.82
-40.98
-44.83
-48.88
-51.93
-54.89
-56.20
-58.24
-60.75
-65.36
-69.46
-72.92
-75.97
-9.22
-14.54
-15.34
-14.77
-12.98
-11.18
-10.11
-9.04
-8.18
-7.21
-6.34
-5.70
-5.46
-5.21
-4.87
-4.57
-4.12
-3.88
-3.84
-4.12
-4.27
-4.20
-3.89
-3.68
-3.63
-44.25
-120.70
-143.16
-154.13
-152.42
-153.62
-159.36
-168.90
-177.85
173.42
166.99
161.55
156.21
146.48
136.01
126.28
119.10
115.29
113.04
108.40
99.58
88.88
80.17
76.19
76.34
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 3 of 4
May 2007
WJA1010
+5V Active-Bias InGaP HBT Gain Block
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C
reflow temperature) and leaded
(maximum 245
°C
reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Mechanical Information
Outline Drawing
Product Marking
The WJA1010 will be marked with an “A1010”
designator with an alphanumeric lot code
marked below the part designator.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes
≥
1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes
≥
1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
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