SRAM Module, 512KX32, 12ns, CMOS, PQCC68,
| Parameter Name | Attribute value |
| Maker | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown |
| Maximum access time | 12 ns |
| JESD-30 code | S-PQCC-J68 |
| memory density | 16777216 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 68 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| organize | 512KX32 |
| Package body material | PLASTIC/EPOXY |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Terminal form | J BEND |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| EDI8L32512C12AC | EDI8L32512C17AC | EDI8L32512C15AC | EDI8L32512C20AC | EDI8L32512C25AC | |
|---|---|---|---|---|---|
| Description | SRAM Module, 512KX32, 12ns, CMOS, PQCC68, | SRAM Module, 512KX32, 17ns, CMOS, PQCC68, | SRAM Module, 2MX8, 15ns, CMOS, PQCC68, | SRAM Module, 2MX8, 20ns, CMOS, PQCC68, | SRAM Module, 2MX8, 25ns, CMOS, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 12 ns | 17 ns | 15 ns | 20 ns | 25 ns |
| JESD-30 code | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-XQMA-J68 |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 32 | 32 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 68 | 68 | 68 | 68 | 68 |
| word count | 524288 words | 524288 words | 2097152 words | 2097152 words | 2097152 words |
| character code | 512000 | 512000 | 2000000 | 2000000 | 2000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| organize | 512KX32 | 512KX32 | 2MX8 | 2MX8 | 2MX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Maker | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | - | - |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C |
| Maximum supply voltage (Vsup) | - | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | - | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible |
| Other features | - | - | CONFIGURABLE AS 512K X 32 | CONFIGURABLE AS 512K X 32 | CONFIGURABLE AS 512K X 32 |
| I/O type | - | - | COMMON | COMMON | COMMON |
| Output characteristics | - | - | 3-STATE | 3-STATE | 3-STATE |
| encapsulated code | - | - | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | - | - | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
| power supply | - | - | 5 V | 5 V | 5 V |
| Maximum standby current | - | - | 0.12 A | 0.12 A | 0.12 A |
| Minimum standby current | - | - | 4.75 V | 4.75 V | 4.75 V |
| Maximum slew rate | - | - | 0.8 mA | 0.76 mA | 0.76 mA |
| Terminal pitch | - | - | 1.27 mm | 1.27 mm | 1.27 mm |
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