SRAM Module, 512KX32, 17ns, CMOS, PQCC68,
Parameter Name | Attribute value |
Maker | EDI [Electronic devices inc.] |
Reach Compliance Code | unknown |
Maximum access time | 17 ns |
JESD-30 code | S-PQCC-J68 |
memory density | 16777216 bit |
Memory IC Type | SRAM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX32 |
Package body material | PLASTIC/EPOXY |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | J BEND |
Terminal location | QUAD |
Base Number Matches | 1 |
EDI8L32512C17AC | EDI8L32512C12AC | EDI8L32512C15AC | EDI8L32512C20AC | EDI8L32512C25AC | |
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Description | SRAM Module, 512KX32, 17ns, CMOS, PQCC68, | SRAM Module, 512KX32, 12ns, CMOS, PQCC68, | SRAM Module, 2MX8, 15ns, CMOS, PQCC68, | SRAM Module, 2MX8, 20ns, CMOS, PQCC68, | SRAM Module, 2MX8, 25ns, CMOS, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 17 ns | 12 ns | 15 ns | 20 ns | 25 ns |
JESD-30 code | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-XQMA-J68 |
memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 32 | 32 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 68 | 68 | 68 | 68 | 68 |
word count | 524288 words | 524288 words | 2097152 words | 2097152 words | 2097152 words |
character code | 512000 | 512000 | 2000000 | 2000000 | 2000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
organize | 512KX32 | 512KX32 | 2MX8 | 2MX8 | 2MX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
Maker | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | - | - |
Maximum operating temperature | 70 °C | - | 70 °C | 70 °C | 70 °C |
Maximum supply voltage (Vsup) | 5.25 V | - | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V | - | 4.75 V | 4.75 V | 4.75 V |
Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Is it Rohs certified? | - | - | incompatible | incompatible | incompatible |
Other features | - | - | CONFIGURABLE AS 512K X 32 | CONFIGURABLE AS 512K X 32 | CONFIGURABLE AS 512K X 32 |
I/O type | - | - | COMMON | COMMON | COMMON |
Output characteristics | - | - | 3-STATE | 3-STATE | 3-STATE |
encapsulated code | - | - | QCCJ | QCCJ | QCCJ |
Encapsulate equivalent code | - | - | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
power supply | - | - | 5 V | 5 V | 5 V |
Maximum standby current | - | - | 0.12 A | 0.12 A | 0.12 A |
Minimum standby current | - | - | 4.75 V | 4.75 V | 4.75 V |
Maximum slew rate | - | - | 0.8 mA | 0.76 mA | 0.76 mA |
Terminal pitch | - | - | 1.27 mm | 1.27 mm | 1.27 mm |