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EDI8L32512C17AC

Description
SRAM Module, 512KX32, 17ns, CMOS, PQCC68,
Categorystorage    storage   
File Size732KB,6 Pages
ManufacturerEDI [Electronic devices inc.]
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EDI8L32512C17AC Overview

SRAM Module, 512KX32, 17ns, CMOS, PQCC68,

EDI8L32512C17AC Parametric

Parameter NameAttribute value
MakerEDI [Electronic devices inc.]
Reach Compliance Codeunknown
Maximum access time17 ns
JESD-30 codeS-PQCC-J68
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formJ BEND
Terminal locationQUAD
Base Number Matches1
This Material Copyrighted By Its Respective Manufacturer

EDI8L32512C17AC Related Products

EDI8L32512C17AC EDI8L32512C12AC EDI8L32512C15AC EDI8L32512C20AC EDI8L32512C25AC
Description SRAM Module, 512KX32, 17ns, CMOS, PQCC68, SRAM Module, 512KX32, 12ns, CMOS, PQCC68, SRAM Module, 2MX8, 15ns, CMOS, PQCC68, SRAM Module, 2MX8, 20ns, CMOS, PQCC68, SRAM Module, 2MX8, 25ns, CMOS,
Reach Compliance Code unknown unknown unknown unknown unknown
Maximum access time 17 ns 12 ns 15 ns 20 ns 25 ns
JESD-30 code S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-XQMA-J68
memory density 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 68 68 68 68 68
word count 524288 words 524288 words 2097152 words 2097152 words 2097152 words
character code 512000 512000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
organize 512KX32 512KX32 2MX8 2MX8 2MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Terminal form J BEND J BEND J BEND J BEND J BEND
Terminal location QUAD QUAD QUAD QUAD QUAD
Base Number Matches 1 1 1 1 1
Maker EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] - -
Maximum operating temperature 70 °C - 70 °C 70 °C 70 °C
Maximum supply voltage (Vsup) 5.25 V - 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V - 4.75 V 4.75 V 4.75 V
Temperature level COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL
Is it Rohs certified? - - incompatible incompatible incompatible
Other features - - CONFIGURABLE AS 512K X 32 CONFIGURABLE AS 512K X 32 CONFIGURABLE AS 512K X 32
I/O type - - COMMON COMMON COMMON
Output characteristics - - 3-STATE 3-STATE 3-STATE
encapsulated code - - QCCJ QCCJ QCCJ
Encapsulate equivalent code - - LDCC68,1.0SQ LDCC68,1.0SQ LDCC68,1.0SQ
power supply - - 5 V 5 V 5 V
Maximum standby current - - 0.12 A 0.12 A 0.12 A
Minimum standby current - - 4.75 V 4.75 V 4.75 V
Maximum slew rate - - 0.8 mA 0.76 mA 0.76 mA
Terminal pitch - - 1.27 mm 1.27 mm 1.27 mm

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