SPC582B60E1L0X1Y datasheet, PDF

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SPC582B60E1L0X1Y: DescriptionRISC MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，102 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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SPC582B60E1L0X1Y Overview

RISC MICROCONTROLLER

SPC582B60E1L0X1Y Parametric

Parameter Name	Attribute value
Maker	STMicroelectronics
package instruction	HTFQFP,
Reach Compliance Code	compliant
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	40 MHz
DMA channel	YES
External data bus width
length	10 mm
Number of terminals	64
PWM channel	YES
encapsulated code	HTFQFP
Package shape	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
speed	64 MHz
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER RISC
Base Number Matches	1

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SPC582B60x, SPC582B54x,

SPC582B50x

32-bit Power Architecture

microcontroller for automotive ASIL-B

applications

Datasheet

production data

– Cyclic redundancy check (CRC) unit

– End-to-end Error Correction Code

(e2eECC) logic



Crossbar switch architecture for concurrent

access to peripherals, Flash, or RAM from

multiple bus masters with end-to-end ECC



Body cross triggering unit (BCTU)

– Triggers ADC conversions from any eMIOS

channel

– Triggers ADC conversions from up to 2

dedicated PIT_RTIs

– 1 event configuration register dedicated to

each timer event allows to define the

corresponding ADC channel

– Synchronization with ADC to avoid collision



1 enhanced 12-bit SAR analog-to-digital

converters

– Up to 27 channels

– enhanced diagnosis feature



Communication interfaces

– 6 LINFlexD modules

– 4 deserial serial peripheral interface (DSPI)

modules

– 7 MCAN interfaces with advanced shared

memory scheme and ISO CAN FD support



Dual phase-locked loops with stable clock

domain for peripherals and FM modulation

domain for computational shell



Nexus Class 3 debug and trace interface



Boot assist Flash (BAF) supports factory

programming using a serial bootload through

the asynchronous CAN or LIN/UART.



Enhanced modular IO subsystem (eMIOS): up

to 32 timed I/O channels with 16-bit counter

resolution



Advanced and flexible supply scheme

– On-chip voltage regulator for 1.2 V core

logic supply.



Junction temperature range -40 °C to 150 °C

eTQFP64 (10 x 10 x 1.0 mm)

eTQFP100 (14 x 14 x 1.0 mm)

Features



AEC-Q100 qualified



High performance e200z2 single core

– 32-bit Power Architecture technology CPU

– Core frequency as high as 80 MHz

– Variable Length Encoding (VLE)

– Floating Point, End-to-End Error Correction



1088 KB (1024 KB code flash + 64 KB data

flash) on-chip flash memory: supports read

during program and erase operations, and

multiple blocks allowing EEPROM emulation



96 KB on-chip general-purpose SRAM



Multi-channel direct memory access controller

(eDMA) with 16 channels



1 interrupt controller (INTC)



Comprehensive new generation ASIL-B safety

concept

– ASIL-B of ISO 26262

– FCCU for collection and reaction to failure

notifications

– Memory Error Management Unit (MEMU)

for collection and reporting of error events

in memories

June 2018

This is information on a product in full production.

DS11597 Rev 3

1/102

www.st.com

SPC582B60x, SPC582B54x, SPC582B50x

Table of contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1

1.2

1.3

1.4

1.5

Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Device feature summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Feature overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 11

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.3.1

Power domains and power up/down sequencing . . . . . . . . . . . . . . . . . 16

Electromagnetic emission characteristics . . . . . . . . . . . . . . . . . . . . . . . . 18

Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Temperature profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Device consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

I/O pad specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.8.1

3.8.2

3.8.3

I/O input DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

I/O output DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

I/O pad current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.9

3.10

Reset pad (PORST) electrical characteristics . . . . . . . . . . . . . . . . . . . . . 34

PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

3.10.1

3.10.2

PLL0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Crystal oscillator 40 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

RC oscillator 16 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Low power RC oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

ADC input description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

3.11

Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

3.11.1

3.11.2

3.11.3

3.12

ADC system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

3.12.1

DS11597 Rev 3

3/102

Table of contents

3.12.2

SPC582B60x, SPC582B54x, SPC582B50x

SAR ADC 12 bit electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . 45

Power management integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Voltage regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Voltage monitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

3.13

Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

3.13.1

3.13.2

3.13.3

3.14

3.15

Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

3.15.1

3.15.2

3.15.3

3.15.4

3.15.5

Debug and calibration interface timing . . . . . . . . . . . . . . . . . . . . . . . . . 61

DSPI timing with CMOS pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

CAN timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

UART timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

I2C timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

4.1

4.2

4.3

4.4

eTQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

eTQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

eTQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

4.4.1

4.4.2

4.4.3

eTQFP64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

eTQFP100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

General notes for specifications at maximum junction temperature . . . 91

Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

4/102

DS11597 Rev 3

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