GM23V8000A-30 datasheet, PDF - EEWORLD Datasheet

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GM23V8000A-30: DescriptionMASK ROM, 1MX8, 300ns, CMOS, PDIP32, DIP-32; Categorystorage storage; File Size239KB，5 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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GM23V8000A-30 Overview

MASK ROM, 1MX8, 300ns, CMOS, PDIP32, DIP-32

GM23V8000A-30 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
package instruction	DIP, DIP32,.6
Reach Compliance Code	compliant
Maximum access time	300 ns
JESD-30 code	R-PDIP-T32
JESD-609 code	e0
length	42.0375 mm
memory density	8388608 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	4.826 mm
Maximum standby current	0.00005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

GM23V8000A-30 Related Products

	GM23V8000A-30	GM23V8000AFW-15	GM23V8000AFW-20	GM23V8000A-25	GM23V8000A-15	GM23V8000AFW-30	GM23V8000AFW-25	GM23V8000A-20
Description	MASK ROM, 1MX8, 300ns, CMOS, PDIP32, DIP-32	MASK ROM, 1MX8, 150ns, CMOS, PDSO32, SOP-32	MASK ROM, 1MX8, 200ns, CMOS, PDSO32, SOP-32	MASK ROM, 1MX8, 250ns, CMOS, PDIP32, DIP-32	MASK ROM, 1MX8, 150ns, CMOS, PDIP32, DIP-32	MASK ROM, 1MX8, 300ns, CMOS, PDSO32, SOP-32	MASK ROM, 1MX8, 250ns, CMOS, PDSO32, SOP-32	MASK ROM, 1MX8, 200ns, CMOS, PDIP32, DIP-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
package instruction	DIP, DIP32,.6	SOP, SOP32,.56	SOP, SOP32,.56	DIP, DIP32,.6	DIP, DIP32,.6	SOP, SOP32,.56	SOP, SOP32,.56	DIP, DIP32,.6
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	300 ns	150 ns	200 ns	250 ns	150 ns	300 ns	250 ns	200 ns
JESD-30 code	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	42.0375 mm	20.498 mm	20.498 mm	42.0375 mm	42.0375 mm	20.498 mm	20.498 mm	42.0375 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	DIP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	DIP32,.6	SOP32,.56	SOP32,.56	DIP32,.6	DIP32,.6	SOP32,.56	SOP32,.56	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3/3.3 V	3.3 V	3/3.3 V	3/3.3 V	3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.826 mm	3.2 mm	3.2 mm	4.826 mm	4.826 mm	3.2 mm	3.2 mm	4.826 mm
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	11.2015 mm	11.2015 mm	15.24 mm	15.24 mm	11.2015 mm	11.2015 mm	15.24 mm
Base Number Matches	1	1	1	1	1	1	1	1

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