MASK ROM, 1MX8, 150ns, CMOS, PDSO32, SOP-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SK Hynix |
package instruction | SOP, SOP32,.56 |
Reach Compliance Code | compliant |
Maximum access time | 150 ns |
JESD-30 code | R-PDSO-G32 |
JESD-609 code | e0 |
length | 20.498 mm |
memory density | 8388608 bit |
Memory IC Type | MASK ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP32,.56 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 3.2 mm |
Maximum standby current | 0.00005 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 11.2015 mm |
Base Number Matches | 1 |
GM23V8000AFW-15 | GM23V8000A-30 | GM23V8000AFW-20 | GM23V8000A-25 | GM23V8000A-15 | GM23V8000AFW-30 | GM23V8000AFW-25 | GM23V8000A-20 | |
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Description | MASK ROM, 1MX8, 150ns, CMOS, PDSO32, SOP-32 | MASK ROM, 1MX8, 300ns, CMOS, PDIP32, DIP-32 | MASK ROM, 1MX8, 200ns, CMOS, PDSO32, SOP-32 | MASK ROM, 1MX8, 250ns, CMOS, PDIP32, DIP-32 | MASK ROM, 1MX8, 150ns, CMOS, PDIP32, DIP-32 | MASK ROM, 1MX8, 300ns, CMOS, PDSO32, SOP-32 | MASK ROM, 1MX8, 250ns, CMOS, PDSO32, SOP-32 | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, DIP-32 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
package instruction | SOP, SOP32,.56 | DIP, DIP32,.6 | SOP, SOP32,.56 | DIP, DIP32,.6 | DIP, DIP32,.6 | SOP, SOP32,.56 | SOP, SOP32,.56 | DIP, DIP32,.6 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Maximum access time | 150 ns | 300 ns | 200 ns | 250 ns | 150 ns | 300 ns | 250 ns | 200 ns |
JESD-30 code | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 20.498 mm | 42.0375 mm | 20.498 mm | 42.0375 mm | 42.0375 mm | 20.498 mm | 20.498 mm | 42.0375 mm |
memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | SOP | DIP | DIP | SOP | SOP | DIP |
Encapsulate equivalent code | SOP32,.56 | DIP32,.6 | SOP32,.56 | DIP32,.6 | DIP32,.6 | SOP32,.56 | SOP32,.56 | DIP32,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.2 mm | 4.826 mm | 3.2 mm | 4.826 mm | 4.826 mm | 3.2 mm | 3.2 mm | 4.826 mm |
Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | NO | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 11.2015 mm | 15.24 mm | 11.2015 mm | 15.24 mm | 15.24 mm | 11.2015 mm | 11.2015 mm | 15.24 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |