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GM23V8000AFW-15

Description
MASK ROM, 1MX8, 150ns, CMOS, PDSO32, SOP-32
Categorystorage    storage   
File Size239KB,5 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

GM23V8000AFW-15 Overview

MASK ROM, 1MX8, 150ns, CMOS, PDSO32, SOP-32

GM23V8000AFW-15 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
package instructionSOP, SOP32,.56
Reach Compliance Codecompliant
Maximum access time150 ns
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length20.498 mm
memory density8388608 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.2 mm
Maximum standby current0.00005 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width11.2015 mm
Base Number Matches1

GM23V8000AFW-15 Related Products

GM23V8000AFW-15 GM23V8000A-30 GM23V8000AFW-20 GM23V8000A-25 GM23V8000A-15 GM23V8000AFW-30 GM23V8000AFW-25 GM23V8000A-20
Description MASK ROM, 1MX8, 150ns, CMOS, PDSO32, SOP-32 MASK ROM, 1MX8, 300ns, CMOS, PDIP32, DIP-32 MASK ROM, 1MX8, 200ns, CMOS, PDSO32, SOP-32 MASK ROM, 1MX8, 250ns, CMOS, PDIP32, DIP-32 MASK ROM, 1MX8, 150ns, CMOS, PDIP32, DIP-32 MASK ROM, 1MX8, 300ns, CMOS, PDSO32, SOP-32 MASK ROM, 1MX8, 250ns, CMOS, PDSO32, SOP-32 MASK ROM, 1MX8, 200ns, CMOS, PDIP32, DIP-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
package instruction SOP, SOP32,.56 DIP, DIP32,.6 SOP, SOP32,.56 DIP, DIP32,.6 DIP, DIP32,.6 SOP, SOP32,.56 SOP, SOP32,.56 DIP, DIP32,.6
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
Maximum access time 150 ns 300 ns 200 ns 250 ns 150 ns 300 ns 250 ns 200 ns
JESD-30 code R-PDSO-G32 R-PDIP-T32 R-PDSO-G32 R-PDIP-T32 R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 20.498 mm 42.0375 mm 20.498 mm 42.0375 mm 42.0375 mm 20.498 mm 20.498 mm 42.0375 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX8 1MX8 1MX8 1MX8 1MX8 1MX8 1MX8 1MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP SOP DIP DIP SOP SOP DIP
Encapsulate equivalent code SOP32,.56 DIP32,.6 SOP32,.56 DIP32,.6 DIP32,.6 SOP32,.56 SOP32,.56 DIP32,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.2 mm 4.826 mm 3.2 mm 4.826 mm 4.826 mm 3.2 mm 3.2 mm 4.826 mm
Maximum standby current 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 11.2015 mm 15.24 mm 11.2015 mm 15.24 mm 15.24 mm 11.2015 mm 11.2015 mm 15.24 mm
Base Number Matches 1 1 1 1 1 1 1 1

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