|
BA8274 |
BA8274F |
Description |
I2C bus line buffer IC |
I2C bus line buffer IC |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
ROHM Semiconductor |
ROHM Semiconductor |
Parts packaging code |
DIP |
SOIC |
package instruction |
DIP, |
LSOP, |
Contacts |
8 |
8 |
Reach Compliance Code |
compli |
compli |
series |
8274 |
8274 |
JESD-30 code |
R-PDIP-T8 |
R-PDSO-G8 |
JESD-609 code |
e3/e2 |
e3/e2 |
length |
9.3 mm |
5 mm |
Logic integrated circuit type |
BUFFER |
BUFFER |
Number of functions |
2 |
2 |
Number of entries |
1 |
1 |
Number of terminals |
8 |
8 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
LSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
SMALL OUTLINE, LOW PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
3.7 mm |
1.6 mm |
Maximum supply voltage (Vsup) |
12 V |
12 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
NO |
YES |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
TIN/TIN COPPER |
TIN/TIN COPPER |
Terminal form |
THROUGH-HOLE |
GULL WING |
Terminal pitch |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
10 |
10 |
width |
7.62 mm |
4.4 mm |