I2C bus line buffer IC
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | ROHM Semiconductor |
Parts packaging code | SOIC |
package instruction | LSOP, |
Contacts | 8 |
Reach Compliance Code | compli |
series | 8274 |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3/e2 |
length | 5 mm |
Logic integrated circuit type | BUFFER |
Number of functions | 2 |
Number of entries | 1 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LSOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 12 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
Temperature level | INDUSTRIAL |
Terminal surface | TIN/TIN COPPER |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 10 |
width | 4.4 mm |
BA8274F | BA8274 | |
---|---|---|
Description | I2C bus line buffer IC | I2C bus line buffer IC |
Is it lead-free? | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to |
Maker | ROHM Semiconductor | ROHM Semiconductor |
Parts packaging code | SOIC | DIP |
package instruction | LSOP, | DIP, |
Contacts | 8 | 8 |
Reach Compliance Code | compli | compli |
series | 8274 | 8274 |
JESD-30 code | R-PDSO-G8 | R-PDIP-T8 |
JESD-609 code | e3/e2 | e3/e2 |
length | 5 mm | 9.3 mm |
Logic integrated circuit type | BUFFER | BUFFER |
Number of functions | 2 | 2 |
Number of entries | 1 | 1 |
Number of terminals | 8 | 8 |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LSOP | DIP |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, LOW PROFILE | IN-LINE |
Peak Reflow Temperature (Celsius) | 260 | 260 |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 1.6 mm | 3.7 mm |
Maximum supply voltage (Vsup) | 12 V | 12 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | YES | NO |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN/TIN COPPER | TIN/TIN COPPER |
Terminal form | GULL WING | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
Maximum time at peak reflow temperature | 10 | 10 |
width | 4.4 mm | 7.62 mm |