|
74LCX32MTCX |
74LCX32MX_NL |
74LCX32MTCX_NL |
74LCX32 |
74LCX32MTC |
Description |
LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14 |
LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, QCC14 |
LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14 |
LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, QCC14 |
LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14 |
series |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
Number of functions |
4 |
4 |
4 |
4 |
4 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 Cel |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 Cel |
-40 °C |
surface mount |
YES |
YES |
YES |
Yes |
YES |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
Terminal location |
DUAL |
DUAL |
DUAL |
QUAD |
DUAL |
Is it lead-free? |
Lead free |
- |
Lead free |
- |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
- |
conform to |
Maker |
Fairchild |
Fairchild |
Fairchild |
- |
Fairchild |
Parts packaging code |
TSSOP |
SOIC |
TSSOP |
- |
TSSOP |
package instruction |
4.40 MM, LEAD FREE, MO-153, TSSOP-14 |
SOP, SOP14,.25 |
TSSOP, TSSOP14,.25 |
- |
4.40 MM, LEAD FREE, MO-153, TSSOP-14 |
Contacts |
14 |
14 |
14 |
- |
14 |
Reach Compliance Code |
compliant |
compli |
compliant |
- |
compliant |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
- |
R-PDSO-G14 |
JESD-609 code |
e4 |
e3 |
e3 |
- |
e4 |
length |
5 mm |
8.6235 mm |
5 mm |
- |
5 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
- |
50 pF |
Logic integrated circuit type |
OR GATE |
OR GATE |
OR GATE |
- |
OR GATE |
MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
- |
0.024 A |
Humidity sensitivity level |
1 |
1 |
1 |
- |
1 |
Number of entries |
2 |
2 |
2 |
- |
2 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SOP |
TSSOP |
- |
TSSOP |
Encapsulate equivalent code |
TSSOP14,.25 |
SOP14,.25 |
TSSOP14,.25 |
- |
TSSOP14,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
- |
RAIL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
260 |
260 |
- |
NOT SPECIFIED |
power supply |
3.3 V |
3.3 V |
3.3 V |
- |
3.3 V |
Prop。Delay @ Nom-Sup |
5.5 ns |
- |
5.5 ns |
- |
5.5 ns |
propagation delay (tpd) |
6.6 ns |
6.6 ns |
6.6 ns |
- |
6.6 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
- |
NO |
Maximum seat height |
1.2 mm |
1.753 mm |
1.2 mm |
- |
1.2 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
- |
3.6 V |
Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
- |
2 V |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
- |
2.5 V |
technology |
CMOS |
CMOS |
CMOS |
- |
CMOS |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Matte Tin (Sn) |
Matte Tin (Sn) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal pitch |
0.65 mm |
1.27 mm |
0.65 mm |
- |
0.65 mm |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
width |
4.4 mm |
3.9 mm |
4.4 mm |
- |
4.4 mm |
Base Number Matches |
1 |
1 |
1 |
- |
1 |