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IPI65R380C6XKSA1

Description
MOSFET LOW POWER_LEGACY
CategoryDiscrete semiconductor    The transistor   
File Size1MB,19 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Environmental Compliance
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IPI65R380C6XKSA1 Overview

MOSFET LOW POWER_LEGACY

IPI65R380C6XKSA1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerInfineon
Parts packaging codeTO-262AA
package instructionIN-LINE, R-PSIP-T3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Avalanche Energy Efficiency Rating (Eas)215 mJ
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage650 V
Maximum drain current (ID)10.6 A
Maximum drain-source on-resistance0.38 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-262AA
JESD-30 codeR-PSIP-T3
JESD-609 codee3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)29 A
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin (Sn)
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON

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Description MOSFET LOW POWER_LEGACY Audio Amplifiers Current Sense Amplifiers Prec 76V Hi-Side Current Sense Amp MOSFET LOW POWER_LEGACY MOSFET N-CH 650V 10.6A TO220 MOSFET N-CH 650V 10.6A TO263
Is it lead-free? Lead free Lead free Lead free - Lead free Contains lead
Is it Rohs certified? conform to conform to conform to - conform to conform to
Maker Infineon Infineon Infineon - Infineon Infineon
Parts packaging code TO-262AA TO-252 D2PAK - TO-220AB D2PAK
package instruction IN-LINE, R-PSIP-T3 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 - FLANGE MOUNT, R-PSFM-T3 SMALL OUTLINE, R-PSSO-G2
Contacts 3 4 4 - 3 4
Reach Compliance Code compliant not_compliant not_compliant - compliant not_compliant
Avalanche Energy Efficiency Rating (Eas) 215 mJ - 215 mJ - 215 mJ 215 mJ
Configuration SINGLE WITH BUILT-IN DIODE - SINGLE WITH BUILT-IN DIODE - SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 650 V - 650 V - 650 V 650 V
Maximum drain current (ID) 10.6 A - 10.6 A - 10.6 A 10.6 A
Maximum drain-source on-resistance 0.38 Ω - 0.38 Ω - 0.38 Ω 0.38 Ω
FET technology METAL-OXIDE SEMICONDUCTOR - METAL-OXIDE SEMICONDUCTOR - METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code TO-262AA - TO-263AB - TO-220AB TO-263AB
JESD-30 code R-PSIP-T3 - R-PSSO-G2 - R-PSFM-T3 R-PSSO-G2
JESD-609 code e3 - e3 - e3 e3
Number of components 1 - 1 - 1 1
Number of terminals 3 - 2 - 3 2
Operating mode ENHANCEMENT MODE - ENHANCEMENT MODE - ENHANCEMENT MODE ENHANCEMENT MODE
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR - RECTANGULAR - RECTANGULAR RECTANGULAR
Package form IN-LINE - SMALL OUTLINE - FLANGE MOUNT SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Polarity/channel type N-CHANNEL - N-CHANNEL - N-CHANNEL N-CHANNEL
Maximum pulsed drain current (IDM) 29 A - 29 A - 29 A 29 A
Certification status Not Qualified - Not Qualified - Not Qualified Not Qualified
surface mount NO - YES - NO YES
Terminal surface Tin (Sn) - Matte Tin (Sn) - Tin (Sn) Tin (Sn)
Terminal form THROUGH-HOLE - GULL WING - THROUGH-HOLE GULL WING
Terminal location SINGLE - SINGLE - SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
transistor applications SWITCHING - SWITCHING - SWITCHING SWITCHING
Transistor component materials SILICON - SILICON - SILICON SILICON

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