|
24AA02-I-PG |
24AA02-I-STG |
24LC02B-I-STG |
24AA02T-I-SNG |
24AA02T-I/OTG |
24AA02T-I/MSG |
24LC02B-I/MSG |
24AA02-I/SNG |
24LC02BT-I/SNG |
Description |
EEPROM 256x8 - 1.8V Lead Free Package |
EEPROM 256x8 - 1.8V Lead Free Package |
EEPROM 256x8 - 1.8V Lead Free Package |
EEPROM 256x8 - 1.8V Lead Free Package |
EEPROM 256x8 - 1.8V Lead Free Package |
Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package |
Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package |
Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package |
Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package |
Is it lead-free? |
- |
- |
- |
- |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
- |
- |
- |
- |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
- |
- |
- |
- |
SOT-23 |
MSOP |
MSOP |
SOIC |
SOIC |
package instruction |
- |
- |
- |
- |
ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN |
ROHS COMPLIANT, PLASTIC, MSOP-8 |
ROHS COMPLIANT, PLASTIC, MSOP-8 |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
Contacts |
- |
- |
- |
- |
5 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
- |
- |
- |
- |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN code |
- |
- |
- |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum clock frequency (fCLK) |
- |
- |
- |
- |
0.1 MHz |
0.1 MHz |
0.4 MHz |
0.1 MHz |
0.4 MHz |
Data retention time - minimum |
- |
- |
- |
- |
200 |
200 |
200 |
200 |
200 |
Durability |
- |
- |
- |
- |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
I2C control byte |
- |
- |
- |
- |
1010XXXR |
1010XXXR |
1010XXXR |
1010XXXR |
1010XXXR |
JESD-30 code |
- |
- |
- |
- |
R-PDSO-G5 |
S-PDSO-G8 |
S-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
- |
- |
- |
- |
e3 |
e3 |
e3 |
e3 |
e3 |
length |
- |
- |
- |
- |
2.9 mm |
3 mm |
3 mm |
4.9 mm |
4.9 mm |
memory density |
- |
- |
- |
- |
2048 bit |
2048 bit |
2048 bit |
2048 bit |
2048 bit |
Memory IC Type |
- |
- |
- |
- |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
memory width |
- |
- |
- |
- |
8 |
8 |
8 |
8 |
8 |
Humidity sensitivity level |
- |
- |
- |
- |
1 |
1 |
1 |
1 |
1 |
Number of functions |
- |
- |
- |
- |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
- |
- |
- |
- |
5 |
8 |
8 |
8 |
8 |
word count |
- |
- |
- |
- |
256 words |
256 words |
256 words |
256 words |
256 words |
character code |
- |
- |
- |
- |
256 |
256 |
256 |
256 |
256 |
Operating mode |
- |
- |
- |
- |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
- |
- |
- |
- |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
- |
- |
- |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
- |
- |
- |
- |
256X8 |
256X8 |
256X8 |
256X8 |
256X8 |
Package body material |
- |
- |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
- |
- |
- |
LSSOP |
TSSOP |
TSSOP |
SOP |
SOP |
Encapsulate equivalent code |
- |
- |
- |
- |
TSOP5/6,.11,37 |
TSSOP8,.19 |
TSSOP8,.19 |
SOP8,.25 |
SOP8,.25 |
Package shape |
- |
- |
- |
- |
RECTANGULAR |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
Package form |
- |
- |
- |
- |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
Parallel/Serial |
- |
- |
- |
- |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
- |
- |
- |
- |
260 |
260 |
260 |
260 |
260 |
power supply |
- |
- |
- |
- |
2/5 V |
2/5 V |
3/5 V |
2/5 V |
3/5 V |
Certification status |
- |
- |
- |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
- |
- |
- |
- |
1.45 mm |
1.1 mm |
1.1 mm |
1.75 mm |
1.75 mm |
Serial bus type |
- |
- |
- |
- |
I2C |
I2C |
I2C |
I2C |
I2C |
Maximum standby current |
- |
- |
- |
- |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
Maximum slew rate |
- |
- |
- |
- |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
Maximum supply voltage (Vsup) |
- |
- |
- |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
- |
- |
- |
- |
1.7 V |
1.7 V |
2.5 V |
1.7 V |
2.5 V |
Nominal supply voltage (Vsup) |
- |
- |
- |
- |
2.5 V |
2.5 V |
5 V |
2.5 V |
5 V |
surface mount |
- |
- |
- |
- |
YES |
YES |
YES |
YES |
YES |
technology |
- |
- |
- |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
- |
- |
- |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
- |
- |
- |
- |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Terminal form |
- |
- |
- |
- |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
- |
- |
- |
- |
0.95 mm |
0.65 mm |
0.65 mm |
1.27 mm |
1.27 mm |
Terminal location |
- |
- |
- |
- |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
- |
- |
- |
- |
40 |
40 |
40 |
40 |
40 |
width |
- |
- |
- |
- |
1.55 mm |
3 mm |
3 mm |
3.9 mm |
3.9 mm |
Maximum write cycle time (tWC) |
- |
- |
- |
- |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
write protect |
- |
- |
- |
- |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
Base Number Matches |
- |
- |
- |
- |
1 |
1 |
1 |
1 |
1 |