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24LC02B-I/MSG

Description
Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package
Categorystorage    storage   
File Size231KB,25 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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24LC02B-I/MSG Overview

Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package

24LC02B-I/MSG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeMSOP
package instructionROHS COMPLIANT, PLASTIC, MSOP-8
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum200
Durability1000000 Write/Erase Cycles
I2C control byte1010XXXR
JESD-30 codeS-PDSO-G8
JESD-609 codee3
length3 mm
memory density2048 bit
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256X8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Serial bus typeI2C
Maximum standby current0.000001 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
Base Number Matches1

24LC02B-I/MSG Related Products

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Description Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package EEPROM 256x8 - 1.8V Lead Free Package EEPROM 256x8 - 1.8V Lead Free Package EEPROM 256x8 - 1.8V Lead Free Package EEPROM 256x8 - 1.8V Lead Free Package EEPROM 256x8 - 1.8V Lead Free Package Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package Electrically Erasable Programmable Read Only Memory 256x8 - 1.8V Lead Free Package
Is it lead-free? Lead free - - - - Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to - - - - conform to conform to conform to conform to
Parts packaging code MSOP - - - - SOT-23 MSOP SOIC SOIC
package instruction ROHS COMPLIANT, PLASTIC, MSOP-8 - - - - ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN ROHS COMPLIANT, PLASTIC, MSOP-8 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
Contacts 8 - - - - 5 8 8 8
Reach Compliance Code compliant - - - - compliant compliant compliant compliant
ECCN code EAR99 - - - - EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 0.4 MHz - - - - 0.1 MHz 0.1 MHz 0.1 MHz 0.4 MHz
Data retention time - minimum 200 - - - - 200 200 200 200
Durability 1000000 Write/Erase Cycles - - - - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010XXXR - - - - 1010XXXR 1010XXXR 1010XXXR 1010XXXR
JESD-30 code S-PDSO-G8 - - - - R-PDSO-G5 S-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 - - - - e3 e3 e3 e3
length 3 mm - - - - 2.9 mm 3 mm 4.9 mm 4.9 mm
memory density 2048 bit - - - - 2048 bit 2048 bit 2048 bit 2048 bit
Memory IC Type EEPROM - - - - EEPROM EEPROM EEPROM EEPROM
memory width 8 - - - - 8 8 8 8
Humidity sensitivity level 1 - - - - 1 1 1 1
Number of functions 1 - - - - 1 1 1 1
Number of terminals 8 - - - - 5 8 8 8
word count 256 words - - - - 256 words 256 words 256 words 256 words
character code 256 - - - - 256 256 256 256
Operating mode SYNCHRONOUS - - - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C - - - - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - - - - -40 °C -40 °C -40 °C -40 °C
organize 256X8 - - - - 256X8 256X8 256X8 256X8
Package body material PLASTIC/EPOXY - - - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP - - - - LSSOP TSSOP SOP SOP
Encapsulate equivalent code TSSOP8,.19 - - - - TSOP5/6,.11,37 TSSOP8,.19 SOP8,.25 SOP8,.25
Package shape SQUARE - - - - RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - - - - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL - - - - SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 - - - - 260 260 260 260
power supply 3/5 V - - - - 2/5 V 2/5 V 2/5 V 3/5 V
Certification status Not Qualified - - - - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm - - - - 1.45 mm 1.1 mm 1.75 mm 1.75 mm
Serial bus type I2C - - - - I2C I2C I2C I2C
Maximum standby current 0.000001 A - - - - 0.000001 A 0.000001 A 0.000001 A 0.000001 A
Maximum slew rate 0.003 mA - - - - 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 5.5 V - - - - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.5 V - - - - 1.7 V 1.7 V 1.7 V 2.5 V
Nominal supply voltage (Vsup) 5 V - - - - 2.5 V 2.5 V 2.5 V 5 V
surface mount YES - - - - YES YES YES YES
technology CMOS - - - - CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - - - - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) - - - - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING - - - - GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm - - - - 0.95 mm 0.65 mm 1.27 mm 1.27 mm
Terminal location DUAL - - - - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 - - - - 40 40 40 40
width 3 mm - - - - 1.55 mm 3 mm 3.9 mm 3.9 mm
Maximum write cycle time (tWC) 5 ms - - - - 5 ms 5 ms 5 ms 5 ms
write protect HARDWARE - - - - HARDWARE HARDWARE HARDWARE HARDWARE
Base Number Matches 1 - - - - 1 1 1 1

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