GS78108AB-8 datasheet, PDF - EEWORLD Datasheet

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GS78108AB-8: Description1M x 8 8Mb Asynchronous SRAM; Categorystorage storage; File Size443KB，11 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS78108AB-8 Overview

1M x 8 8Mb Asynchronous SRAM

GS78108AB-8 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	BGA,
Contacts	119
Reach Compliance Code	compli
ECCN code	3A991.B.2.B
Factory Lead Time	25 weeks 5 days
Maximum access time	8 ns
Other features	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	8388608 bi
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	119
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.99 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

GS78108AB-8 Related Products

	GS78108AB-8	GS78108AB	GS78108AB-12	GS78108AGB-8I	GS78108AGB-15I	GS78108AGB-10I	GS78108AB-15I	GS78108AB-12I
Description	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM
Is it lead-free?	Contains lead	-	Contains lead	Lead free	Lead free	Lead free	Contains lead	Contains lead
Is it Rohs certified?	incompatible	-	incompatible	conform to	conform to	conform to	incompatible	incompatible
Maker	GSI Technology	-	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology
Parts packaging code	BGA	-	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	-	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	119	-	119	119	119	119	119	119
Reach Compliance Code	compli	-	compli	compli	compli	compli	compli	compli
ECCN code	3A991.B.2.B	-	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Factory Lead Time	25 weeks 5 days	-	25 weeks 5 days	12 weeks	-	12 weeks	-	25 weeks 5 days
Maximum access time	8 ns	-	12 ns	8 ns	15 ns	10 ns	15 ns	12 ns
Other features	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	-	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT
JESD-30 code	R-PBGA-B119	-	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
JESD-609 code	e0	-	e0	e1	e1	e1	e0	e0
length	22 mm	-	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
memory density	8388608 bi	-	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	-	8	8	8	8	8	8
Humidity sensitivity level	3	-	3	3	3	3	3	3
Number of functions	1	-	1	1	1	1	1	1
Number of terminals	119	-	119	119	119	119	119	119
word count	1048576 words	-	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	-	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1MX8	-	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	-	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	260	260	260	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.99 mm	-	1.99 mm	1.99 mm	1.99 mm	1.99 mm	1.99 mm	1.99 mm
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	-	TIN LEAD	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD	TIN LEAD
Terminal form	BALL	-	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	-	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

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