1M x 8 8Mb Asynchronous SRAM
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | GSI Technology |
| Parts packaging code | BGA |
| package instruction | BGA, |
| Contacts | 119 |
| Reach Compliance Code | compli |
| ECCN code | 3A991.B.2.B |
| Factory Lead Time | 25 weeks 5 days |
| Maximum access time | 12 ns |
| Other features | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT |
| JESD-30 code | R-PBGA-B119 |
| JESD-609 code | e0 |
| length | 22 mm |
| memory density | 8388608 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 119 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1.99 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
| GS78108AB-12 | GS78108AB | GS78108AB-8 | GS78108AGB-8I | GS78108AGB-15I | GS78108AGB-10I | GS78108AB-15I | GS78108AB-12I | |
|---|---|---|---|---|---|---|---|---|
| Description | 1M x 8 8Mb Asynchronous SRAM | 1M x 8 8Mb Asynchronous SRAM | 1M x 8 8Mb Asynchronous SRAM | 1M x 8 8Mb Asynchronous SRAM | 1M x 8 8Mb Asynchronous SRAM | 1M x 8 8Mb Asynchronous SRAM | 1M x 8 8Mb Asynchronous SRAM | 1M x 8 8Mb Asynchronous SRAM |
| Is it lead-free? | Contains lead | - | Contains lead | Lead free | Lead free | Lead free | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | - | incompatible | conform to | conform to | conform to | incompatible | incompatible |
| Maker | GSI Technology | - | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
| Parts packaging code | BGA | - | BGA | BGA | BGA | BGA | BGA | BGA |
| package instruction | BGA, | - | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, |
| Contacts | 119 | - | 119 | 119 | 119 | 119 | 119 | 119 |
| Reach Compliance Code | compli | - | compli | compli | compli | compli | compli | compli |
| ECCN code | 3A991.B.2.B | - | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| Factory Lead Time | 25 weeks 5 days | - | 25 weeks 5 days | 12 weeks | - | 12 weeks | - | 25 weeks 5 days |
| Maximum access time | 12 ns | - | 8 ns | 8 ns | 15 ns | 10 ns | 15 ns | 12 ns |
| Other features | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT | - | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT |
| JESD-30 code | R-PBGA-B119 | - | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 |
| JESD-609 code | e0 | - | e0 | e1 | e1 | e1 | e0 | e0 |
| length | 22 mm | - | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
| memory density | 8388608 bi | - | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi |
| Memory IC Type | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | 3 | - | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 119 | - | 119 | 119 | 119 | 119 | 119 | 119 |
| word count | 1048576 words | - | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | - | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | - | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 1MX8 | - | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | BGA | - | BGA | BGA | BGA | BGA | BGA | BGA |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.99 mm | - | 1.99 mm | 1.99 mm | 1.99 mm | 1.99 mm | 1.99 mm | 1.99 mm |
| Maximum supply voltage (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | - | YES | YES | YES | YES | YES | YES |
| technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | - | TIN LEAD | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN LEAD | TIN LEAD |
| Terminal form | BALL | - | BALL | BALL | BALL | BALL | BALL | BALL |
| Terminal pitch | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 14 mm | - | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD