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GS78108AGB-10I

Description
1M x 8 8Mb Asynchronous SRAM
Categorystorage    storage   
File Size443KB,11 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS78108AGB-10I Overview

1M x 8 8Mb Asynchronous SRAM

GS78108AGB-10I Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codecompli
ECCN code3A991.B.2.B
Factory Lead Time12 weeks
Maximum access time10 ns
Other featuresTHIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT
JESD-30 codeR-PBGA-B119
JESD-609 codee1
length22 mm
memory density8388608 bi
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals119
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX8
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.99 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm

GS78108AGB-10I Related Products

GS78108AGB-10I GS78108AB GS78108AB-12 GS78108AB-8 GS78108AGB-8I GS78108AGB-15I GS78108AB-15I GS78108AB-12I
Description 1M x 8 8Mb Asynchronous SRAM 1M x 8 8Mb Asynchronous SRAM 1M x 8 8Mb Asynchronous SRAM 1M x 8 8Mb Asynchronous SRAM 1M x 8 8Mb Asynchronous SRAM 1M x 8 8Mb Asynchronous SRAM 1M x 8 8Mb Asynchronous SRAM 1M x 8 8Mb Asynchronous SRAM
Is it lead-free? Lead free - Contains lead Contains lead Lead free Lead free Contains lead Contains lead
Is it Rohs certified? conform to - incompatible incompatible conform to conform to incompatible incompatible
Maker GSI Technology - GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology
Parts packaging code BGA - BGA BGA BGA BGA BGA BGA
package instruction BGA, - BGA, BGA, BGA, BGA, BGA, BGA,
Contacts 119 - 119 119 119 119 119 119
Reach Compliance Code compli - compli compli compli compli compli compli
ECCN code 3A991.B.2.B - 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Factory Lead Time 12 weeks - 25 weeks 5 days 25 weeks 5 days 12 weeks - - 25 weeks 5 days
Maximum access time 10 ns - 12 ns 8 ns 8 ns 15 ns 15 ns 12 ns
Other features THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT - THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT
JESD-30 code R-PBGA-B119 - R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119
JESD-609 code e1 - e0 e0 e1 e1 e0 e0
length 22 mm - 22 mm 22 mm 22 mm 22 mm 22 mm 22 mm
memory density 8388608 bi - 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi
Memory IC Type STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 - 8 8 8 8 8 8
Humidity sensitivity level 3 - 3 3 3 3 3 3
Number of functions 1 - 1 1 1 1 1 1
Number of terminals 119 - 119 119 119 119 119 119
word count 1048576 words - 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 - 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C - 70 °C 70 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - - - -40 °C -40 °C -40 °C -40 °C
organize 1MX8 - 1MX8 1MX8 1MX8 1MX8 1MX8 1MX8
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA - BGA BGA BGA BGA BGA BGA
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 - NOT SPECIFIED NOT SPECIFIED 260 260 NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.99 mm - 1.99 mm 1.99 mm 1.99 mm 1.99 mm 1.99 mm 1.99 mm
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V - 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES - YES YES YES YES YES YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER - TIN LEAD TIN LEAD TIN SILVER COPPER TIN SILVER COPPER TIN LEAD TIN LEAD
Terminal form BALL - BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 14 mm - 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
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