Multiplexer, 2-Func, 4 Line Input, CMOS, CDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | MULTIPLEXER |
MaximumI(ol) | 0.024 A |
Number of functions | 2 |
Number of entries | 4 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Prop。Delay @ Nom-Sup | 18 ns |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
CD54ACT253FX | CD54ACT253F/3A | CD54ACT253F | CD54AC253F | CD54AC253FX | CD54AC253F/3A | |
---|---|---|---|---|---|---|
Description | Multiplexer, 2-Func, 4 Line Input, CMOS, CDIP16 | Multiplexer, 2-Func, 4 Line Input, CMOS, CDIP16 | Multiplexer, 2-Func, 4 Line Input, CMOS, CDIP16 | Multiplexer, AC Series, 2-Func, 4 Line Input, 1 Line Output, True Output, CMOS, CDIP16, DIP-16 | Multiplexer, 2-Func, 4 Line Input, CMOS, CDIP16 | Multiplexer, 2-Func, 4 Line Input, CMOS, CDIP16 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-CDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.012 A | 0.012 A | 0.012 A |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
Number of entries | 4 | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
Prop。Delay @ Nom-Sup | 18 ns | 22 ns | 18 ns | 18.6 ns | 18.6 ns | 23 ns |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP-16 | - | - |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |