IS61LV2568L-8TL-TR datasheet, PDF

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IS61LV2568L-8TL-TR: DescriptionSRAM 2Mb (256k x 8) Async SRAM 3.3v; Categorystorage; File Size187KB，14 Pages; ManufacturerISSI(Integrated Silicon Solution Inc.); Websitehttp://www.issi.com/

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IS61LV2568L-8TL-TR Overview

SRAM 2Mb (256k x 8) Async SRAM 3.3v

IS61LV2568L-8TL-TR Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	ISSI(Integrated Silicon Solution Inc.)
Product Category	SRAM
RoHS	Details
Package / Case	TSOP-44
Packaging	Reel
Moisture Sensitive	Yes
Factory Pack Quantity	1000

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IS61LV2568L

256K x 8 HIGH-SPEED CMOS STATIC RAM

FEATURES

•

High-speed access time: 8, 10 ns

Operating Current: 50mA (typ.)

Standby Current: 700µA (typ.)

Multiple center power and ground pins for

greater noise immunity

Easy memory expansion with

and

options

power-down

TTL compatible inputs and outputs

Single 3.3V power supply

Packages available:

– 36-pin 400-mil SOJ

– 44-pin TSOP (Type II)

Lead-free available

APRIL 2008

DESCRIPTION

The

ISSI

IS61LV2568L is a very high-speed, low power,

262,144-word by 8-bit CMOS static RAM. The IS61LV2568L

is fabricated using

ISSI

's high-performance CMOS tech-

nology. This highly reliable process coupled with innova-

tive circuit design techniques, yields higher performance

and low power consumption devices.

When

is HIGH (deselected), the device assumes a

standby mode at which the power dissipation can be

reduced down to 36mW (max.) with CMOS input levels.

The IS61LV2568L operates from a single 3.3V power

supply and all inputs are TTL-compatible.

The IS61LV2568L is available in 36-pin 400-mil SOJ and

44-pin TSOP (Type II) packages.

•

FUNCTIONAL BLOCK DIAGRAM

A0-A17

DECODER

256K X 8

MEMORY ARRAY

GND

I/O

DATA

CIRCUIT

I/O0-I/O7

COLUMN I/O

CONTROL

CIRCUIT

without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc. — www.issi.com —

1-800-379-4774

Rev. D

04/28/08

IS61LV2568L-8TL-TR Related Products

	IS61LV2568L-8TL-TR	IS61LV2568L-10TL-TR	IS61LV2568L-8TL	IS61LV2568L-10KLI
Description	SRAM 2Mb (256k x 8) Async SRAM 3.3v	SRAM 2Mb 256Kx8 10ns Async SRAM 3.3v	SRAM 2Mb (256k x 8) Async SRAM 3.3v	SRAM 2Mb 256Kx8 10ns Async SRAM 3.3v
Is it lead-free?	-	Lead free	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to
Parts packaging code	-	TSOP2	TSOP2	SOJ
package instruction	-	TSOP2,	TSOP2, TSOP44,.46,32	SOJ, SOJ36,.44
Contacts	-	44	44	36
Reach Compliance Code	-	compliant	compliant	compliant
ECCN code	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Factory Lead Time	-	8 weeks	8 weeks	8 weeks
Maximum access time	-	10 ns	8 ns	10 ns
JESD-30 code	-	R-PDSO-G44	R-PDSO-G44	R-PDSO-J36
JESD-609 code	-	e3	e3	e3
length	-	18.415 mm	18.415 mm	23.5 mm
memory density	-	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	8	8	8
Humidity sensitivity level	-	3	3	3
Number of functions	-	1	1	1
Number of terminals	-	44	44	36
word count	-	262144 words	262144 words	262144 words
character code	-	256000	256000	256000
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	70 °C	70 °C	85 °C
organize	-	256KX8	256KX8	256KX8
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TSOP2	TSOP2	SOJ
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	260	260	260
Certification status	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.2 mm	1.2 mm	3.75 mm
Maximum supply voltage (Vsup)	-	3.63 V	3.63 V	3.63 V
Minimum supply voltage (Vsup)	-	2.97 V	3.135 V	2.97 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES
technology	-	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	-	MATTE TIN	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	-	GULL WING	GULL WING	J BEND
Terminal pitch	-	0.8 mm	0.8 mm	1.27 mm
Terminal location	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	40	10	40
width	-	10.16 mm	10.16 mm	10.16 mm
Base Number Matches	-	1	1	1

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