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AT28BV64B-20SC

Description
EEPROM 200NS IND TEMP PKG- 200NS COM TEMP
Categorystorage    storage   
File Size387KB,17 Pages
ManufacturerAtmel (Microchip)
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AT28BV64B-20SC Overview

EEPROM 200NS IND TEMP PKG- 200NS COM TEMP

AT28BV64B-20SC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeSOIC
package instructionSOP, SOP28,.4
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
Other features100K ENDURANCE CYCLES; DATA RETENTION = 10 YEARS
command user interfaceNO
Data pollingYES
Data retention time - minimum10
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length17.9 mm
memory density65536 bit
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level2
Number of functions1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
page size64 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum standby current0.00002 A
Maximum slew rate0.015 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
switch bitYES
width7.5 mm
Maximum write cycle time (tWC)10 ms

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Description EEPROM 200NS IND TEMP PKG- 200NS COM TEMP EEPROM 200NS IND TEMP PKG- 250NS COM TEMP EEPROM 200NS IND TEMP PKG- 200NS IND TEMP EEPROM 200NS IND TEMP PKG- 200NS IND TEMP EEPROM 200NS IND TEMP PKG- 250NS COM TEMP EEPROM 200NS IND TEMP PKG- 200NS COM TEMP
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC SOIC SOIC TSOP1 QFJ DIP
package instruction SOP, SOP28,.4 SOP, SOP28,.4 SOP, SOP28,.4 TSOP1, TSSOP28,.53,22 QCCJ, LDCC32,.5X.6 DIP, DIP28,.6
Contacts 28 28 28 28 32 28
Reach Compliance Code unknown unknown unknown compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 250 ns 200 ns 200 ns 250 ns 200 ns
Other features 100K ENDURANCE CYCLES; DATA RETENTION = 10 YEARS 100K ENDURANCE CYCLES; DATA RETENTION = 10 YEARS 100K ENDURANCE CYCLES; DATA RETENTION = 10 YEARS 100K ENDURANCE CYCLES; DATA RETENTION = 10 YEARS 100K ENDURANCE CYCLES; DATA RETENTION = 10 YEARS 100K ENDURANCE CYCLES; DATA RETENTION = 10 YEARS
command user interface NO NO NO NO NO NO
Data polling YES YES YES YES YES YES
Data retention time - minimum 10 10 10 10 10 10
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PQCC-J32 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
length 17.9 mm 17.9 mm 17.9 mm 11.8 mm 13.97 mm 37.0205 mm
memory density 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Humidity sensitivity level 2 2 2 3 2 1
Number of functions 1 1 1 1 1 1
Number of terminals 28 28 28 28 32 28
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP TSOP1 QCCJ DIP
Encapsulate equivalent code SOP28,.4 SOP28,.4 SOP28,.4 TSSOP28,.53,22 LDCC32,.5X.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE CHIP CARRIER IN-LINE
page size 64 words 64 words 64 words 64 words 64 words 64 words
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 NOT SPECIFIED 240 225 225
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Programming voltage 3 V 3 V 3 V 3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 2.65 mm 2.65 mm 1.2 mm 3.556 mm 4.826 mm
Maximum standby current 0.00002 A 0.00002 A 0.00005 A 0.00005 A 0.00002 A 0.00002 A
Maximum slew rate 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING J BEND THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 0.55 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL QUAD DUAL
Maximum time at peak reflow temperature 30 30 NOT SPECIFIED 30 30 30
switch bit YES YES YES YES YES YES
width 7.5 mm 7.5 mm 7.5 mm 8 mm 11.43 mm 15.24 mm
Maximum write cycle time (tWC) 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms
Maker Atmel (Microchip) Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
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