74AUP1G126GW datasheet, PDF - EEWORLD Datasheet

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74AUP1G126GW: DescriptionLow-Power buffer/line driver; 3-state; Categorylogic logic; File Size81KB，20 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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74AUP1G126GW Overview

Low-Power buffer/line driver; 3-state

74AUP1G126GW Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	TSSOP, TSSOP5/6,.08
Reach Compliance Code	unknow
Control type	ENABLE HIGH
JESD-30 code	R-PDSO-G5
JESD-609 code	e0
Load capacitance (CL)	30 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.0017 A
Number of digits	1
Number of functions	1
Number of terminals	5
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP5/6,.08
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL
power supply	1.2/3.3 V
Prop。Delay @ Nom-Su	24 ns
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL

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74AUP1G126

Low-power buffer/line driver; 3-state

Rev. 01 — 25 July 2005

Product data sheet

1. General description

The 74AUP1G126 is a high-performance, low-power, low-voltage, Si-gate CMOS device,

superior to most advanced CMOS compatible TTL families.

Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall

times across the entire V

range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire

range from 0.8 V to 3.6 V.

This device is fully speciﬁed for partial Power-down applications using I

OFF

The I

OFF

circuitry disables the output, preventing the damaging backﬂow current through

the device when it is powered down.

The 74AUP1G126 provides the single non-inverting buffer/line driver with 3-state output.

The 3-state output is controlled by the output enable input (OE). A LOW level at pin OE

causes the output to assume a high-impedance OFF-state.

This device has the input-disable feature, which allows ﬂoating input signals. The inputs

are disabled when the output enable input OE is LOW.

2. Features

Wide supply voltage range from 0.8 V to 3.6 V

High noise immunity

Complies with JEDEC standards:

JESD8-12 (0.8 V to 1.3 V)

JESD8-11 (0.9 V to 1.65 V)

JESD8-7 (1.2 V to 1.95 V)

JESD8-5 (1.8 V to 2.7 V)

JESD8-B (2.7 V to 3.6 V)

ESD protection:

HBM JESD22-A114-C exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

CDM JESD22-C101-C exceeds 1000 V

Low static power consumption; I

= 0.9

µA

(maximum)

Latch-up performance exceeds 100 mA per JESD 78 Class II

Inputs accept voltages up to 3.6 V

Low noise overshoot and undershoot < 10 % of V

Input-disable feature allows ﬂoating input conditions

74AUP1G126GW Related Products

	74AUP1G126GW	74AUP1G126	74AUP1G126GM
Description	Low-Power buffer/line driver; 3-state	Low-Power buffer/line driver; 3-state	Low-Power buffer/line driver; 3-state
Is it Rohs certified?	incompatible	-	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	TSSOP, TSSOP5/6,.08	-	SON, SOLCC6,.04,20
Reach Compliance Code	unknow	-	unknow
Control type	ENABLE HIGH	-	ENABLE HIGH
JESD-30 code	R-PDSO-G5	-	R-PDSO-N6
JESD-609 code	e0	-	e0
Load capacitance (CL)	30 pF	-	30 pF
Logic integrated circuit type	BUS DRIVER	-	BUS DRIVER
MaximumI(ol)	0.0017 A	-	0.0017 A
Number of digits	1	-	1
Number of functions	1	-	1
Number of terminals	5	-	6
Maximum operating temperature	125 °C	-	125 °C
Minimum operating temperature	-40 °C	-	-40 °C
Output characteristics	3-STATE	-	3-STATE
Output polarity	TRUE	-	TRUE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	TSSOP	-	SON
Encapsulate equivalent code	TSSOP5/6,.08	-	SOLCC6,.04,20
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE
method of packing	TAPE AND REEL	-	TAPE AND REEL
power supply	1.2/3.3 V	-	1.2/3.3 V
Prop。Delay @ Nom-Su	24 ns	-	24 ns
Certification status	Not Qualified	-	Not Qualified
surface mount	YES	-	YES
technology	CMOS	-	CMOS
Temperature level	AUTOMOTIVE	-	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	NO LEAD
Terminal pitch	0.635 mm	-	0.5 mm
Terminal location	DUAL	-	DUAL

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