Sony HT-Z9F speaker system disassembled with Rockchip RKNanoD chip
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In recent years, with the improvement of people's quality of life, more and more people have begun to pursue a high-quality viewing experience at home. The concept of "home theater" is getting closer and closer to people's lives, and audio plays a pivotal role in "home theater". Since its launch, Sony HT-Z9F wireless home audio system has always been a popular product that consumers consider when choosing a home speaker system.
I Love Audio Network recently got the "Sony HT-Z9F Wireless Home Audio System" developed by Sony. This speaker system consists of a sound bar and a subwoofer. It supports Dolby sound effects, DTS sound effects and VERTICAL SURROUND ENGINE vertical surround engine.
In the actual listening experience, Sony HT-Z9F wireless home audio system is more suitable for watching movies than listening to music. This set of speakers supports Dolby sound and vertical sound, which can provide users with an immersive viewing and gaming experience. Another point worth praising is that the sound wall and the bass speaker are connected wirelessly, but there is no sound delay and excellent sound surround effect.
What is even more surprising is that during the disassembly process of I Love Audio Network, it was discovered that the reason why the Sony HT-Z9F wireless home audio system has rich and full bass effects and the wireless connection is so stable and delay-free is because the subwoofer box uses Rockchip's main control chip RKNANOD, which ensures the stability of the connection between the speaker and the sound bar while bringing a heavy bass impact, helping to create a new dimension of sound with "high quality" and "horizontal surround" for the Sony audio system.
Next, I Love Audio will conduct a detailed disassembly of the Sony HT-Z9F wireless home audio system, and show you what configurations are used inside the Sony HT-Z9F wireless home audio system to support the product's immersive listening experience.
1. Sony HT-Z9F Speaker Unboxing
The front of the box has information on it, with a rendering of the product printed on it. The HT-Z9F wireless home audio system supports Dolby sound, DTS sound, and VERTICAL SURROUND ENGINE vertical surround engine.
The side of the outer packaging shows a schematic diagram of the sound effect of the HT-Z9F speaker's function of "experiencing immersive surround sound through virtual ceiling speakers". The HT-Z9F speaker can achieve 5.1 surround sound when combined with the rear speaker SA-Z9R.
Product highlights: Supports Bluetooth connection, LDAC encoding technology, ClearAudio+ pure sound technology, certified WiFi connection technology, wireless multi-room, wireless subwoofer, HMDI, eARC function, built-in 1.5m long HDMI cable, can download applications in the Apple Store and MFi logo.
The outer packaging suggests that the speaker should be carried by two people. The contents of the package include: 1 active speaker, 1 grille cover, 1 subwoofer, 1 high-speed HDMI cable, 1 remote control, and 1 wall-mount bracket.
The front view of the Sony HT-Z9F system main speaker, which is equipped with a protective cover.
The front of the main speaker is equipped with a protective cover to protect the cavity.
After removing the protective cover, you can see that the front of the speaker is made of brushed material to increase the texture of the speaker, and the black window on the left is the display screen.
A close-up of the speaker, which uses a mica diaphragm.
Close-up of the speaker's OLED display, which is used to display the speaker's working status.
A top view of the main speaker.
The main speaker cover adopts leather texture design, which has a good texture. There are 6 buttons in the center of the speaker cover, including "power button, input source switch, Bluetooth, music service, volume plus and minus buttons", which still adopts the simple design concept.
A look at the bottom of the main speaker.
A fence design is adopted at the bottom of the main speaker, which corresponds to the position of the product power motherboard, to enhance air circulation and facilitate heat dissipation.
Close-up of the fixing screw holes used to secure the speaker stand.
The label information on the back of the main speaker. System model : HT-Z9F, wireless home audio system; Model: SA-Z9F, active speaker, CMIIT ID: 2018AJ1119, working voltage: 220V~240V, frequency: 50/60Hz, power 52W, USB: 5V500mA. Only suitable for safe use in areas below 2000m above sea level, and only suitable for safe use in non-tropical climate conditions.
Close-up of the IR repeater on the bottom of the speaker , which transmits the remote control signal from the TV remote control to the TV.
From the bottom of the speaker, you can see that the speaker interface is placed obliquely on a triangular plate, which is convenient for wiring and internal space design.
The speaker has a window for heat dissipation of the internal power supply.
From top to bottom are the LAN network cable interface, 2 HDMI IN interfaces, and 1 HDMI OUT interface.
An overview of the USB interface for playing music , the 3.5mm audio interface, and the square-port optical fiber input interface.
Front view of the subwoofer.
The back of the subwoofer.
Labels on the back of the subwoofer, Wireless Home Audio System Model: HT-Z9F, Speaker Model: SA-WZ9F,
220V-240V ~ 50/60 Hz 20 W£¬CMIIT ID: 2018AJ1081¡£
There are two buttons on the back of the subwoofer, including the power button and the connect button.
A look at the included remote control, the appearance is in Sony's usual style.
Open the battery cover and you will see that the remote control is powered by 2 AA batteries.
Remote control information at a glance: output 3V DC, made in Indonesia.
2. Sony HT-Z9F Wireless Home Audio System Disassembly
Subwoofer
Next, we will disassemble the subwoofer.
First remove the screws on the speaker back panel and remove the speaker back panel.
The power supply motherboard and speaker motherboard of the speaker are designed on the back panel of the speaker.
Remove the power supply main board and the speaker main board.
Close-up of the back of the two small connection boards that are connected to the speaker's power supply motherboard.
Close-up of the front of the two small connection boards connected to the speaker's power mainboard.
A close-up of the two buttons on the small connecting board, with a layer of sponge on top to prevent vibration and noise.
Remove the sponge from the button and connect it to the button on the motherboard, which corresponds to the power button of the speaker.
3.5mm port hidden under the cover .
The front view of the built-in power PCB board of the subwoofer . At a glance, capacitors, transformers and other components are reinforced with glue, and there is also a heat sink to help dissipate heat from the high-voltage switch tube and the output synchronous rectifier tube.
A look at the back of the subwoofer's power supply motherboard.
The common-mode inductor on the power PCB is wound with two wires to filter out EMI interference.
The output filter capacitor is from Rubycon, with a withstand voltage of 400V and a capacity of 150¦ÌF.
Close-up of the transformer.
Close-up of the output Schottky rectifier tube, fixed to the heat sink to assist in heat dissipation.
Varistor, used for overvoltage protection.
X2 safety capacitor.
D2SB rectifier bridge.
Primary switch MOS tube, from Rohm, R6015KNX, NMOS, withstand voltage 600V, conduction resistance 0.29¦¸.
Close-up of the rectifier diode, from Qiangmao.
The output filter capacitor is from nichicon, with a withstand voltage of 35V and a capacity of 2200¦ÌF.
A front view of the amplifier mainboard.
A look at the back of the amplifier motherboard.
Sanken SI-3000KM linear regulator uses a series of regulator ICs with low saturation voltage drop PNP bipolar transistors in the power section, which can correspond to low input-output voltage differences. It is equipped with an OnOff terminal when ActiveHi is in operation, and the circuit consumption current is 0 when Off.
Equipped with: 17V withstand voltage so that the output capacitor can use ceramic capacitors product series (SI-3012KM, SI-3025KM, SI-3033KM), and the output capacitor uses electrolytic capacitors high withstand voltage (35V) product series (SI-3010KM, SI-3050KM, SI-3090KM, SI-3120KM).
Detailed information of Sanken model SI-3000KM linear voltage regulator.
Richtek RT7272B "3A, 36V, 500kHz" synchronous step-down DC/DC converter. The output current can reach 3A within the input voltage range of 4.5V to 36V. It integrates high-end 150m¦¸ and low-end 80m¦¸ MOSFETs to achieve a high conversion efficiency of 95%. The current mode control architecture supports fast transient response and simple compensation. The cycle-by-cycle current limiting mechanism can provide circuit protection when the output is short-circuited, and the built-in slow start mechanism can eliminate the input current surge problem at the startup moment.
In addition, the RT7272B provides complete protection functions, such as input low voltage lockout mechanism, output low voltage protection, over current protection and thermal shutdown protection. The RT7272B adopts SOP-8 (exposed pad) package specification.
Detailed data sheet of the Richtek RT7272B converter.
TI Texas Instruments model PCM1808 99dBSNR stereo ADC with single-ended input. The PCM1808 device uses a ¦²-¦¤ modulator with 64x oversampling and includes a digital decimation filter and high-pass filter to remove the DC component of the input signal. For various applications, the PCM1808 device supports master and slave modes and two data formats in the serial audio interface. The PCM1808 device supports power-down and reset functions by stopping the system clock.
The PCM1808 device is suitable for a wide range of cost-sensitive consumer applications that require good performance and operating voltage (5V analog supply and 3.3V digital supply). The PCM1808 device is manufactured using a highly advanced CMOS process. The device is available in a small 14-pin TSSOP package.
Detailed data sheet of the 99dBSNR stereo ADC from TI, model PCM1808.
IC with silkscreen "Y70352".
The main control chip with SONY silk-screen "D3776ER".
The power filter capacitor is from Japan Chemical, with a withstand voltage of 35V and a capacity of 2200¦ÌF.
Close-up of the output filter inductor of the digital power amplifier.
The power filter capacitor is from Japan Chemical, with a withstand voltage of 35V and a capacity of 2200¦ÌF.
Close-up of filter film capacitor.
IC with ¡°D1G 046¡± printed on it .
The subwoofer's audio amplifier has a metal heat sink.
Remove the metal strip. There is thermal grease applied to the area corresponding to the center of the audio amplifier.
TI Texas Instruments TAS5624A PWM input Class D audio amplifier with thermally enhanced performance 150W stereo, 400W mono. Use large MOSFETs to improve power efficiency, and adopt a new gate drive scheme to reduce losses in idle state and when the output signal is low, thereby reducing the size of the heat sink.
The TAS5624A can control a Class G power supply using a unique pre-clamped output signal. This advantage, combined with the low idle losses and high power efficiency of the TAS5624A, enables industry-leading efficiency levels, ensuring the construction of super systems.
The TAS5624A uses constant voltage gain. Internally matched gain resistors ensure that the device has a high power supply rejection ratio, so that the output voltage depends only on the audio input voltage and is not affected by any power supply. The high integration of the TAS5624A makes the amplifier easy to use; in addition, using TI's reference schematics and PCB layout shortens design time. The TAS5624A uses a space-saving surface-mount 44-pin HTSSOP package.
Detailed data sheet of the TI Texas Instruments model TAS5624A PWM-input Class-D audio amplifier.
A front view of the wireless module board connected to the main control chip.
A look at the back of the small board to which the main control chip is connected.
Close-up of the printed Bluetooth antenna on the back of the main control board.
Open the upper cover of the metal protective cover.
An overview of the circuit inside the metal protective cover.
Two ICs with ¡°Fs=N4D¡± printed on them.
A buck IC with ¡°bPCXC¡± printed on it .
Voltage regulator IC with ¡°Cw=MKE¡± printed on it .
MXIC Macronix model 25L3233F serial NOR flash memory, 8MB capacity, powered by 3.3V.
Detailed data sheet of MXIC Macronix model 25L3233F serial NOR flash memory.
Realtek Semiconductor model RTL8821CSH is an integrated Bluetooth and wireless chip that supports 1-stream 802.11ac solution, with multi-user MIMO (multiple input, multiple output) and wireless LAN (WLAN) SDIO interface controller, integrated Bluetooth 2.1 / 3.0 / 4.2 HS-UART interface controller. It combines a WLAN MAC, a WLAN baseband supporting 1T1R, and a radio frequency in one chip.
Rockchip RKNANOD is a low-power, high-efficiency, and cost-effective digital multimedia chip that uses ARM Cortex-M3 and Cortex-M4 dual-core processor architecture and has an audio decoder hardware accelerator. By providing a complete set of peripheral interfaces, including VOP, USB OTG, SD/MMC, I2C, I2S, SPI, PWM, etc., RKNANOD can be flexibly applied to various multimedia products and IoT applications.
RKNANOD achieves high-quality wireless audio playback through the following five technical advantages:
1. Stable driving of WiFi modules, accurate reception and analysis of air interface data
2. Support TCP/IP protocol and receive combined audio data packets
3. Efficiently decode audio data packets to ensure bass surround effect
4. Support synchronized air interface time, play audio by timestamp, no delay in wireless connection
5. Support OTA
Detailed information of Rockchip RKNANOD dual-core processor.
HT-Z9F Teardown
First remove the metal cover on the back of the speaker.
After removing the metal cover on the back of the speaker, turn the speaker over to the bottom. The bottom needs to fix the metal gasket that fixes the front and back shells of the speaker. Unscrew the screws of the metal gasket and take out the metal gasket.
After removing the metal pad at the bottom of the speaker, you can separate the front and back shells of the speaker.
Sound-absorbing cotton is placed inside the speaker cabinet to absorb excess sound waves, and the speaker wires are wrapped with sponge to prevent vibration and noise.
An overview of the internal structure of the speaker's rear shell cavity.
The speaker's power supply motherboard is fixed in place using a metal bracket, and the outside is protected by a fence cover that also provides heat dissipation.
The metal bracket at the rear of the speaker is fixed in place with screws.
The speaker in the front shell of the speaker is an independent sealed cavity.
Remove the back cover of the speaker cavity. There is sound-absorbing cotton built into the back cover to reduce distortion.
Close-up of the front of the speaker.
A side view of the speaker.
A look at the back of the speaker.
Speaker label information at a glance, Made in Malaysia.
Close-up of the internal structure of the speaker's back shell. The speaker motherboard uses a large area of aluminum sheet for heat dissipation, and the wiring harness is fixed with insulating tape.
Power input wire socket.
The power input line uses a magnetic ring filter, and the magnetic ring is wrapped with foam.
Overview of the speaker power supply motherboard.
Remove the power board and main control board from the speaker.
A small infrared emitting board is fixed to the bracket of the speaker's rear shell with screws.
Remove the transmitter board.
The small plate is fixed to the hood with screws.
Close-up of the infrared transmitting tube and current limiting resistor.
Another overview of the wireless connection board.
Close-up of the signal amplification chip.
The touch button panel is used to detect the operation of the speaker.
Touch IC with silk screen "3108 2025 8821".
An overview of the speaker amplifier circuit mainboard.
A look at the back of the power amplifier circuit board.
A side view of the power amplifier circuit.
The output filter capacitor is from Rubycon KXW series, with a withstand voltage of 400V and a capacity of 150¦ÌF.
Close-up of the transformer.
The output filter capacitor comes from Japan Chemical, with a withstand voltage of 35V and a capacity of 2700¦ÌF.
Close-up of the two output filter capacitors.
IC with ¡°Q00 1024¡± printed on it .
An overview of the motherboard with integrated speaker interface, which is equipped with a metal cover for heat dissipation.
Most chips on the interface motherboard are attached with thermal pads.
A look at the back of the interface motherboard.
Close-up of 3 HDMI interface sockets and RJ45 network port.
An op amp with silkscreen WHU04.
IC with silkscreen "XF040".
Voltage regulator IC with ¡°J:B101¡± printed on it .
IC with silk screen 7S.
Cypress model CY9BF128SA microcontroller with built-in 32-bit Cortex-M3 core.
IC with silkscreen ¡°2YB W0A 10¡±.
3959 Apple certified chip, used for MFi function.
Winbond W25Q128JVPQ serial NOR flash memory, 128M-bit serial flash memory, with unified 4KB sectors and dual-channel/quad-channel SPI.
Detailed information of Winbond model W25Q128JVPQ serial NOR flash memory.
Active crystal oscillator with silkscreen "A1386".
3 ICs with silkscreen ¡°B5¡±.
IC with silkscreen "BZI 04I" and IC with silkscreen "BWO 493".
HDMI input and output control for Panasonic model MN864788.
Voltage regulator IC with silk screen ¡°4T3K¡±.
Remove the heatsink sticker from the chip on the front of the motherboard.
2 ICs with silkscreen "HB106".
TI TPS563209 3A output synchronous buck chip.
IC with silkscreen ¡°9D3KG¡±.
IC with ¡°S5YS¡± printed on it .
IC with silkscreen AE51.
Richtek RT7272B "3A, 36V, 500kHz" synchronous step-down DC/DC converter. The output current can reach 3A within the input voltage range of 4.5V to 36V. It integrates high-end 150m¦¸ and low-end 80m¦¸ MOSFETs to achieve a high conversion efficiency of 95%. The current mode control architecture supports fast transient response and simple compensation. The cycle-by-cycle current limiting mechanism can provide circuit protection when the output is short-circuited, and the built-in slow start mechanism can eliminate the input current surge problem at the startup moment.
In addition, the RT7272B provides complete protection functions, such as input low voltage lockout mechanism, output low voltage protection, over current protection and thermal shutdown protection. The RT7272B adopts SOP-8 (exposed pad) package specification.
Detailed data sheet of the Richtek RT7272B converter.
Close-up of the first wireless module, used for wireless connection function.
Close-up of the second wireless module, used to connect to the subwoofer.
Pry off the shielding cover.
MTK MediaTek model MT6625L-4-in-1 connectivity chip, including a 2.4GHz Wi-Fi/Bluetooth transceiver front end, a 5GHz Wi-Fi transceiver front end, a GPS receiver front end and a complete FM receiver, as well as integrated passive devices (IPD) in a QFN40 package.
Detailed information diagram of MTK MediaTek model MT6625L-4-in-1 connection chip.
MTK MediaTek model MT6630TP five-in-one connection chip, integrating dual-band WiFi, WiFi Direct/Miracast, Bluetooth 4.1, tri-band GPS, and FM radio frequency functions.
Realtek - Model 8201FR single-chip/single-port 10/100Mbps Ethernet receiver, supporting RMII (Reduced Media Independent Interface) for wired network connection.
MTK MediaTek model MT8591 main control chip, used for speaker function control.
Samsung K4B4G1646E DDR3 memory chip, a single chip provides 512M memory, and two chips together provide 1G memory for the speaker.
MTK MediaTek model MT6323LGA power management chip, including 3 buck converters and 23 LDOs, provides mono 0.7W to 8¦¸, high efficiency level AB/D audio amplifier and flexible LED driver for various indicator applications. It supports up to 4 channels of LED independent control.
Data on the power management chip of MTK MediaTek model MT6323LGA.
Toshoba THGBMNG5D1LBAIT 4GB eMMC memory, used to store firmware and configuration information.
ON Semiconductor LC89075WA digital audio interface receiver demodulates signals according to the data transmission format between digital audio devices through IEC60958/61937 and JEITA CPR-1205, and supports demodulation sampling frequency up to 192kHz.
The LC89075WA also integrates a high-performance 24-bit single-ended input Delta-Sigma stereo analog-to-digital converter that supports sampling frequencies up to 96kHz, and an audio selector that can support 8-channel data. The LC89075WA is a complete analog and digital front end suitable for a variety of systems including AV receivers, digital TVs and DVD recorders.
Detailed information of ON Semiconductor LC89075WA digital audio interface receiver.
TI TPS2065D USB load switch supports output discharge and reverse blocking functions.
Two ICs with ¡°J:C 106¡± printed on them.
Toshoba model MBL3257C 4 -bit bus switch.
Voltage regulator IC with silkscreen ¡°A50¡±.
IC with silk screen ¡°9883 0464¡±.
 LATTICE SiI9437 HDMI eARC receiver.
Rohm BD3508 3A ultra-low dropout linear regulator, supports 5.5V input and 2.7V output.
Rohm BD00HC5WEFJ series 1.5A output current regulator. Output accuracy is ¡À1%. Output voltage can be set arbitrarily from 1.5 to 7.0V by using external resistors. It can be used in digital home appliances and other fields.
The BD00HC5WEFJ series has built-in overcurrent protection circuits to prevent IC damage caused by output short circuits, an ON/OFF switch to set the circuit current to 0¦ÌA when power is off, and a temperature protection circuit to prevent IC thermal damage caused by overloads. In addition, it supports ceramic capacitors, which contributes to the miniaturization and long life of equipment.
Detailed information diagram of Rohm's BD00HC5WEFJ series output current regulator.
Remove the speaker module protected by the metal bracket.
Open the metal bracket cover.
The speaker's OLED display is designed on an independent connection board.
A look at the back of the connection plate.
The patch infrared receiver is used to receive remote control signals.
An overview of the power amplifier circuit on the metal bracket.
The speaker interface is also designed on an independent small board, with the sockets of the three interfaces at a glance.
A look at the back of the interface motherboard.
Close-up of the metal heat sink on the amplifier motherboard.
The back of the metal gasket is coated with thermal grease.
A front view of the speaker's amplifier motherboard.
A look at the back of the amplifier motherboard.
There is a heat sink on the back of the motherboard to assist in heat dissipation.
Close-up of 3 interface sockets.
Three 470¦ÌF filter capacitors, reinforced with glue.
Close-up of the output filter inductor of the digital power amplifier.
An overview of the output filter inductor information of the digital power amplifier.
Close-up of 2 filter capacitors, with a withstand voltage of 6.3V and a capacity of 470¦ÌF.
NJM8065 dual op amp, from JRC, used for audio signal amplification and buffering.
Voltage regulator IC with silkscreen AE51.
Close-up of film capacitors, used for amplifier output filtering.
TI Texas Instruments TAS5538 digital audio processor. TAS5538 has digital audio processing functions and an 8-channel digital pulse width modulator (PWM) with a sampling rate converter, and has advanced performance and high system integration.
The TAS5558 is designed to support DTS-HD specification Blu-ray HTiB applications. The ASRC contains two independent modules, each of which can handle 4 channels. Therefore, it can support up to two different input sampling rates. Texas Instruments (TI) power stages are designed to work seamlessly with the TAS5558. The TAS5558 also provides a high-performance, differential output to drive an external, differential input, analog headphone amplifier. For 48, 96 and 192kHz data, the TAS5558 supports AD, BD and triple modulation with a switching rate of 384kHz. An external crystal with a frequency of 12.288MHz must be used. The TAS5558 also has a power supply capacity control (PSVC) function that increases the dynamic range of low power stages and can be used as part of a Class G power supply when used with a closed-loop PWM input power stage.
Detailed information diagram of the Texas Instruments TAS5538 digital audio processor.
Two audio amplifiers with identical specifications.
TI Texas Instruments TAS5624A PWM input Class D audio amplifier has a thermally enhanced 150W stereo and 400W mono output capability. It uses large MOSFETs to improve power efficiency and adopts a new gate drive scheme to reduce losses in idle state and when the output signal is low, thereby reducing the size of the heat sink.
The TAS5624A can control a Class G power supply using a unique pre-clamped output signal. This advantage, combined with the low idle losses and high power efficiency of the TAS5624A, enables industry-leading efficiency levels, ensuring the construction of super systems.
The TAS5624A uses constant voltage gain. Internally matched gain resistors ensure that the device has a high power supply rejection ratio, so that the output voltage depends only on the audio input voltage and is not affected by any power supply. The high integration of the TAS5624A makes the amplifier easy to use; in addition, using TI's reference schematics and PCB layout shortens design time. The TAS5624A uses a space-saving surface-mount 44-pin HTSSOP package.
Detailed data sheet of the TI Texas Instruments model TAS5624A PWM-input Class-D audio amplifier.
IC with ¡°D1G 046¡± printed on it .
TI TPS563209 3A output synchronous buck regulator.
Voltage regulator IC with ¡°J2S5V¡± printed on it .
Voltage regulator IC with silk screen ¡°65Z6¡±.
Richtek RT7272B "3A, 36V, 500kHz" synchronous step-down DC/DC converter. The output current can reach 3A within the input voltage range of 4.5V to 36V. It integrates high-end 150m¦¸ and low-end 80m¦¸ MOSFETs to achieve a high conversion efficiency of 95%. The current mode control architecture supports fast transient response and simple compensation. The cycle-by-cycle current limiting mechanism can provide circuit protection when the output is short-circuited, and the built-in slow start mechanism can eliminate the input current surge problem at the startup moment.
In addition, the RT7272B provides complete protection functions, such as input low voltage lockout mechanism, output low voltage protection, over current protection and thermal shutdown protection. The RT7272B adopts SOP-8 (exposed pad) package specification.
Detailed data sheet of the Richtek RT7272B converter.
Sony HT-Z9F wireless speaker system disassembly family photo.
3. Summary of I Love Audio Network
Sony HT-Z9F wireless home audio system uses a combination of a soundbar and a subwoofer. Thanks to the "VERTICAL SURROUND ENGINE vertical surround engine", even if the speaker system only has two speakers, Sony HT-Z9F wireless home audio can still provide us with a three-dimensional listening experience. In terms of audio configuration, the soundbar uses three speakers with mica diaphragms, and cooperates with the subwoofer to achieve a shocking sound field listening experience.
Rockchip provides key technical support for Sony's home audio system. RKnanoD, as the control chip of the subwoofer box's WIFI module, ensures the stability of the wireless connection between the speaker and the sound bar. Users can place it in different positions according to home needs to reduce distance and position restrictions, allowing users to enjoy the immersive sound experience of the home audio system and appreciate the live version of the surround sound effect.
Rockchip's RKnanoD chip uses a dual-core processor and is equipped with an audio decoder hardware accelerator. It is a digital multimedia chip specially designed for multimedia products and IoT applications. It has the advantages of low power consumption, high efficiency, and excellent cost performance, and provides key technical support in Sony's audio system.
In terms of wireless connection, the subwoofer uses Realtek Semiconductor model RTL8821CSH with integrated Bluetooth and wireless chip, supports 1-stream 802.11ac solution, has multi-user MIMO (multiple input, multiple output) and wireless LAN (WLAN) SDIO interface controller, and integrated Bluetooth 2.1/3.0/4.2 HS-UART interface controller.
In terms of internal configuration, the sound bar adopts TI Texas Instruments model TAS5624A PWM input Class-D audio amplifier with 150W stereo and 400W mono output capabilities; it adopts TI Texas Instruments model TAS5538 digital audio processor with 8-channel digital pulse width modulator to realize digital audio processing function; the interface adopts ON Semiconductor LC89075WA digital audio interface receiver, which demodulates the signal according to the data transmission format between digital audio devices through IEC60958/61937 and JEITA CPR-1205, and supports demodulation sampling frequency up to 192kHz.
The soundbar's main control circuit uses Toshiba THGBMNG5D1LBAIT 4GB eMMC memory for storing firmware and configuration information; Samsung K4B4G1646E DDR3 memory particles, a single chip provides 512M memory, and two chips together provide 1G memory for the speaker; MTK MediaTek model MT8591 main control chip for speaker function control; Winbond Winbond model W25Q128JVPQ serial port NOR flash memory, 128M-bit serial flash memory, with a unified 4KB sector and dual-channel/quad-channel SPI; Cypress model CY9BF128SA microcontroller with built-in 32-bit Cortex-M3 core.
In terms of power supply, the soundbar uses the MTK MediaTek MT6323LGA power management chip, which includes 3 buck converters and 23 LDOs, providing a single-channel 0.7W to 8¦¸, high-efficiency AB/D audio amplifier; the synchronous step-down DC/DC converter uses the Richtek RT7272B with an input voltage range of 4.5V to 36V and an output current of 3A. It integrates high-end 150m¦¸ and low-end 80m¦¸ MOSFETs to achieve a high conversion efficiency of 95%; the circuit voltage regulator uses the Rohm BD00HC5WEFJ series 1.5A output current regulator with an output accuracy of ¡À1%.
In terms of wireless connection, the sound bar uses the MTK MediaTek MT6630TP five-in-one connection chip, which integrates dual-band WiFi, WiFi Direct/Miracast, Bluetooth 4.1, tri-band GPS, and FM radio frequency functions; the other wireless chip is the MTK MediaTek MT6625L-4-in-1 connection chip, which includes a 2.4GHz Wi-Fi/Bluetooth transceiver front end, a 5GHz Wi-Fi transceiver front end, a GPS receiver front end and a complete FM receiver.
(The content and pictures of this disassembly report are from I Love Audio Network)
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