MOSPEC
GLASS PASSIVATED BRIDGE SINGLE-PHASE
BRIDGE RECTIFIERS
VOLTAGE
50 to 1000 Volts
CURRENT
20 Amperes
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* High case dielectric strength of 2500 V
RMS
* Ideal for printed circuit boards
* Glass passivated chip junction
* High surge current capability
* High temperature soldering guaranteed:
260
o
C
/10 seconds, 0.375 (9.5mm) lead length,
5lbs. (2.3Kg) tension
MECHANICAL DATA
* Case: Molded plastic body
* Terminal: Plated leads solderable per
MIL-STD-750, Method 2026
* Mounting Position: Any
(Note 3)
* Mounting Torque: 8 in-lbs max.
Weight: 0.26 oz., 7.0g
GBJ20A THRU GBJ20M
MAXIMUM RATINGS AND ELECTRICAL CHARATERISTICS
* Rating at 25℃ ambient temperature unless otherwise specified
* Single phase,half wave. 60Hz, resistive or inductive load.
* For capacitive load derate current by 20 %
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectifier Forward Current @ T
C
=87℃
@ T
A
=25℃
Non-Repetitive Peak Surge Current
8.3 ms Single half sine-wave superimposed on
rated load (JEDEC Method)
Forward Voltage (per element) ( I
F
=10 Amp)
Peak Reverse Current
( Rated DC Voltage, T
C
= 25℃)
( Rated DC Voltage, T
C
= 125℃)
I
2
t Rating for Fusing( t<8.3 ms)
Typical Junction Capacitance per element
Maximum Thermal Resistance per leg
Operating and Storage Temperature Range
Symbo
GBJ20A GBJ20B GBJ20D GBJ20G GBJ20J GBJ20K GBJ20M
l
V
RRM
50
100
200
400
600
800
1000
V
RWM
V
R
V
R(RMS)
I
F(AV)
I
FSM
V
FM
I
R
I
2
t
C
j
R
θ
jA
R
θ
jc
T
J
, T
stg
35
70
140
280
20
3.5
(2)
240
1.05
10
250
240
140
22
(2)
1.5
(1)
-55 to +150
(1)
Unit
V
420
560
700
V
A
A
V
uA
A
2
s
pF
o
C/W
℃
Note:
NOTES:
1. Unit case mounted on Al plate heatsink
2. Unit mounted on P.C.B. without heatsink
3. Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screw
GBJ20A thru GBJ20M
FIG-1 FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD RECTIFIED CURRENT (Amp.)
NSTANTANEOUS FORWARD CURRENT (Amp.)
Heatsink Mounting, T
C
FIG-2 TYPICAL FORWARD CHARACTERISITICS
T
j
=25 C
O
Pulse with =300 us
P.C.B. Board
CASE TEMPERATURE (℃)
FORWARD VOLTAGE (Volts)
FIG-3 PEAK FORWARD SURGE CURRENT
CURRENT (Amp.)
FIG-4 TYPICAL JUNCTION CAPACITANCE
PEAK FORWARD SURGE
T
j
=25 C
O
NUMBER OF CYCLES AT 60 Hz
JUNCTION CAPACITANCE (
P
F)
Single Half-Sine Wave
(JEDEC Method)
T
j
=25 C
F=1.0MHz
O
REVERSE VOLTAGE (Volts)
FIG-5 TYPICAL REVERSE CHARACTERISTICS Per leg
O
FIG-6 TYPICAL TRANSIENT THERMAL IMPEDANCE
TRANSIENT THERMAL IMPEDANCE (
O
C/W)
INSTANTANEOUS CURRENT (uA)
T
j
=125 C
T
j
=25 C
O
PERCENT RATED PEAK REVERSE VOLTAGE (%)
T, HEATING TIME (sec)
Microcontroller MCU
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