K4S560832D-TC7A datasheet, PDF

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K4S560832D-TC7A: Description32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD; File Size99KB，11 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K4S560832D-TC7A Overview

32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD

K4S560832D-TC7A Related Products

	K4S560832D-TC7A	K4S560832D-TL7A	K4S560832D-TL1H	K4S560832D-TL7C	M366S3253DTS	K4S560832D-TL1L	K4S560832D-TC1L	K4S560832D-TC1H	K4S560832D-TC7C
Description	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD	32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD
Is it lead-free?	-	-	Contains lead	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	-	-	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible
Maker	-	-	SAMSUNG	SAMSUNG	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	-	-	TSOP2	TSOP2	-	TSOP2	TSOP2	TSOP2	TSOP2
package instruction	-	-	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	-	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32
Contacts	-	-	54	54	-	54	54	54	54
Reach Compliance Code	-	-	unknow	compliant	-	unknow	unknow	unknow	compli
ECCN code	-	-	EAR99	EAR99	-	EAR99	EAR99	EAR99	EAR99
access mode	-	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	-	-	6 ns	5.4 ns	-	6 ns	6 ns	6 ns	5.4 ns
Other features	-	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	-	-	100 MHz	133 MHz	-	100 MHz	100 MHz	100 MHz	133 MHz
I/O type	-	-	COMMON	COMMON	-	COMMON	COMMON	COMMON	COMMON
interleaved burst length	-	-	1,2,4,8	1,2,4,8	-	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8
JESD-30 code	-	-	R-PDSO-G54	R-PDSO-G54	-	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54
JESD-609 code	-	-	e0	e0	-	e0	e0	e0	e0
length	-	-	22.22 mm	22.22 mm	-	22.22 mm	22.22 mm	22.22 mm	22.22 mm
memory density	-	-	268435456 bi	268435456 bit	-	268435456 bi	268435456 bi	268435456 bi	268435456 bi
Memory IC Type	-	-	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	-	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	-	-	8	8	-	8	8	8	8
Number of functions	-	-	1	1	-	1	1	1	1
Number of ports	-	-	1	1	-	1	1	1	1
Number of terminals	-	-	54	54	-	54	54	54	54
word count	-	-	33554432 words	33554432 words	-	33554432 words	33554432 words	33554432 words	33554432 words
character code	-	-	32000000	32000000	-	32000000	32000000	32000000	32000000
Operating mode	-	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	-	70 °C	70 °C	-	70 °C	70 °C	70 °C	70 °C
organize	-	-	32MX8	32MX8	-	32MX8	32MX8	32MX8	32MX8
Output characteristics	-	-	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	TSOP2	TSOP2	-	TSOP2	TSOP2	TSOP2	TSOP2
Encapsulate equivalent code	-	-	TSOP54,.46,32	TSOP54,.46,32	-	TSOP54,.46,32	TSOP54,.46,32	TSOP54,.46,32	TSOP54,.46,32
Package shape	-	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240
power supply	-	-	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	-	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	-	-	8192	8192	-	8192	8192	8192	8192
Maximum seat height	-	-	1.2 mm	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	-	-	YES	YES	-	YES	YES	YES	YES
Continuous burst length	-	-	1,2,4,8,FP	1,2,4,8,FP	-	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP
Maximum standby current	-	-	0.002 A	0.002 A	-	0.002 A	0.002 A	0.002 A	0.002 A
Maximum slew rate	-	-	0.19 mA	0.22 mA	-	0.19 mA	0.19 mA	0.19 mA	0.22 mA
Maximum supply voltage (Vsup)	-	-	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	-	3 V	3 V	-	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	-	-	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	-	YES	YES	-	YES	YES	YES	YES
technology	-	-	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	-	GULL WING	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	-	0.8 mm	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	-	-	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	-	10.16 mm	10.16 mm	-	10.16 mm	10.16 mm	10.16 mm	10.16 mm

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