K7N323645M-FC20 datasheet, PDF

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K7N323645M-FC20: Description1Mx36 & 2Mx18 Pipelined NtRAM; Categorystorage storage; File Size281KB，24 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7N323645M-FC20 Overview

1Mx36 & 2Mx18 Pipelined NtRAM

K7N323645M-FC20 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	LBGA,
Contacts	165
Reach Compliance Code	compli
ECCN code	3A991.B.2.A
Maximum access time	3.2 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	17 mm
memory density	37748736 bi
Memory IC Type	ZBT SRAM
memory width	36
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX36
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm

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K7N323645M

K7N321845M

Document Title

1Mx36 & 2Mx18-Bit Pipelined NtRAM

1Mx36 & 2Mx18 Pipelined NtRAM

Revision History

Rev. No.

0.0

0.1

0.2

History

1. Initial document.

1. Add 165FBGA package

1.Update JTAG scan order

2. Speed bin merge.

From K7N3236(18)49M to K7N3236(18)45M

3. AC parameter change.

tOH(min)/tLZC(min) from 0.8 to 1.5 at -25

tOH(min)/tLZC(min) from 1.0 to 1.5 at -22

tOH(min)/tLZC(min) from 1.0 to 1.5 at -20

1. Change pin out for 165FBGA

- x18/x36 ; 11B => from A to NC , 2R ==> from NC to A

1. Insert pin at JTAG scan order of 165FBGA in connection with

pin out change

- x18/x36 ; insert Pin ID of 2R to BIT number of 69

1. Add Icc, Isb, Isb1 and Isb2 values.

1. Final datasheet release.

1. Change the Stand-by current (Isb)

Before

After

Isb - 25 : 120

170

- 22 : 110

160

- 20 : 100

150

- 16 :

140

- 15 :

140

- 13 :

140

Isb1

110

Isb2

100

1. Delete the 119BGA package

2. Delete the 225MHz and 150MHz speed bin

Draft Date

May. 10. 2001

Aug. 29. 2001

Dec. 31. 2001

Remark

Preliminary

0.3

Feb. 14. 2002

Preliminary

0.4

Apr. 20. 2002

Preliminary

0.5

1.0

1.1

May. 10. 2002

Sep. 26. 2002

Oct. 17, 2003

Preliminary

Final

2.0

Nov. 18, 2003

Final

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.

-1-

Nov. 2003

Rev 2.0

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