FPGA - Field Programmable Gate Array Fusion
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
package instruction | LBGA, |
Reach Compliance Code | unknown |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e0 |
length | 17 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 13824 |
Equivalent number of gates | 600000 |
Number of terminals | 256 |
organize | 13824 CLBS, 600000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 225 |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 1.68 mm |
Maximum supply voltage | 1.575 V |
Minimum supply voltage | 1.425 V |
Nominal supply voltage | 1.5 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 20 |
width | 17 mm |