MC68HC711E9FN datasheet, PDF - EEWORLD Datasheet

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MC68HC711E9FN: DescriptionIC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LDCC,52PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，25 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC68HC711E9FN Overview

IC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LDCC,52PIN,PLASTIC

MC68HC711E9FN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	QCCJ, LDCC52,.8SQ
Reach Compliance Code	unknown
bit size	8
CPU series	6800
JESD-30 code	S-PQCC-J52
JESD-609 code	e0
Number of terminals	52
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	512
rom(word)	12288
ROM programmability	UVPROM
speed	2 MHz
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

MC68HC711E9FN Related Products

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Description	IC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LDCC,52PIN,PLASTIC	IC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LDCC,52PIN,PLASTIC	IC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LDCC,44PIN,PLASTIC	IC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LDCC,44PIN,PLASTIC	IC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LDCC,68PIN,PLASTIC	IC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LDCC,44PIN,PLASTIC	IC,MICROCONTROLLER,8-BIT,6800 CPU,CMOS,LLCC,52PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC44,.7SQ	QCCN, LCC52(UNSPEC)
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
bit size	8	8	8	8	8	8	8
CPU series	6800	6800	6800	6800	6800	6800	6800
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	52	52	44	44	68	44	52
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	85 °C	70 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCN
Encapsulate equivalent code	LDCC52,.8SQ	LDCC52,.8SQ	LDCC44,.7SQ	LDCC44,.7SQ	LDCC68,1.0SQ	LDCC44,.7SQ	LCC52(UNSPEC)
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
power supply	5 V	5 V	5 V	3.3/5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	512	512	192	192	512	192	512
rom(word)	12288	12288	-	4096	16384	-	12288
speed	2 MHz	3 MHz	2 MHz	2 MHz	2 MHz	2 MHz	3 MHz
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	NO LEAD
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maker	NXP	NXP	-	NXP	-	NXP	NXP
JESD-30 code	S-PQCC-J52	S-PQCC-J52	S-PQCC-J44	S-PQCC-J44	S-PQCC-J68	S-PQCC-J44	-
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	-
ROM programmability	UVPROM	UVPROM	-	MROM	UVPROM	-	UVPROM
Nominal supply voltage	5 V	5 V	5 V	-	5 V	5 V	5 V
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-
Base Number Matches	1	1	1	1	1	-	-
Maximum slew rate	-	-	27 mA	27 mA	27 mA	27 mA	-

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