IC,SRAM,16X4,F-TTL,LLCC,20PIN,CERAMIC
Parameter Name | Attribute value |
Maker | National Semiconductor(TI ) |
package instruction | QCCN, LCC20,.35SQ |
Reach Compliance Code | unknown |
Maximum access time | 32 ns |
JESD-30 code | S-XQCC-N20 |
Memory IC Type | STANDARD SRAM |
memory width | 4 |
Number of terminals | 20 |
word count | 16 words |
character code | 16 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 16X4 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC20,.35SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum slew rate | 0.055 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Base Number Matches | 1 |
54F189LMQB | 54F189FMQB | 74F189DC | 74F189QC | 74F189PCQR | |
---|---|---|---|---|---|
Description | IC,SRAM,16X4,F-TTL,LLCC,20PIN,CERAMIC | IC,SRAM,16X4,F-TTL,FP,16PIN,CERAMIC | IC 16 X 4 STANDARD SRAM, 27 ns, CDIP16, CERAMIC, DIP-16, Static RAM | IC 16 X 4 STANDARD SRAM, 27 ns, PQCC20, PLASTIC, CC-20, Static RAM | IC,SRAM,16X4,F-TTL,DIP,16PIN,PLASTIC |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
package instruction | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 32 ns | 32 ns | 27 ns | 27 ns | 27 ns |
JESD-30 code | S-XQCC-N20 | R-XDFP-F16 | R-GDIP-T16 | S-PQCC-J20 | R-PDIP-T16 |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 20 | 16 | 16 | 20 | 16 |
word count | 16 words | 16 words | 16 words | 16 words | 16 words |
character code | 16 | 16 | 16 | 16 | 16 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
organize | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCN | DFP | DIP | QCCJ | DIP |
Encapsulate equivalent code | LCC20,.35SQ | FL16,.3 | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Maximum slew rate | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO | YES | NO |
technology | TTL | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | FLAT | THROUGH-HOLE | J BEND | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
Terminal location | QUAD | DUAL | DUAL | QUAD | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
Is it Rohs certified? | - | - | incompatible | incompatible | incompatible |
JESD-609 code | - | - | e0 | e0 | e0 |
Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |