74F189QC datasheet, PDF - EEWORLD Datasheet

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74F189QC: DescriptionIC 16 X 4 STANDARD SRAM, 27 ns, PQCC20, PLASTIC, CC-20, Static RAM; Categorystorage; File Size208KB，4 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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74F189QC Overview

IC 16 X 4 STANDARD SRAM, 27 ns, PQCC20, PLASTIC, CC-20, Static RAM

74F189QC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	QCCJ, LDCC20,.4SQ
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	27 ns
Other features	INVERTED OUTPUTS
JESD-30 code	S-PQCC-J20
JESD-609 code	e0
length	8.89 mm
memory density	64 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	20
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16X4
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC20,.4SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum slew rate	0.055 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.89 mm
Base Number Matches	1

74F189QC Related Products

	74F189QC	54F189FMQB	54F189LMQB	74F189DC	74F189PCQR
Description	IC 16 X 4 STANDARD SRAM, 27 ns, PQCC20, PLASTIC, CC-20, Static RAM	IC,SRAM,16X4,F-TTL,FP,16PIN,CERAMIC	IC,SRAM,16X4,F-TTL,LLCC,20PIN,CERAMIC	IC 16 X 4 STANDARD SRAM, 27 ns, CDIP16, CERAMIC, DIP-16, Static RAM	IC,SRAM,16X4,F-TTL,DIP,16PIN,PLASTIC
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	QCCJ, LDCC20,.4SQ	DFP, FL16,.3	QCCN, LCC20,.35SQ	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Maximum access time	27 ns	32 ns	32 ns	27 ns	27 ns
JESD-30 code	S-PQCC-J20	R-XDFP-F16	S-XQCC-N20	R-GDIP-T16	R-PDIP-T16
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4
Number of terminals	20	16	20	16	16
word count	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	125 °C	70 °C	70 °C
organize	16X4	16X4	16X4	16X4	16X4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	QCCJ	DFP	QCCN	DIP	DIP
Encapsulate equivalent code	LDCC20,.4SQ	FL16,.3	LCC20,.35SQ	DIP16,.3	DIP16,.3
Package shape	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V
Maximum slew rate	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	J BEND	FLAT	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	QUAD	DUAL	DUAL
Base Number Matches	1	1	1	1	1
Is it Rohs certified?	incompatible	-	-	incompatible	incompatible
JESD-609 code	e0	-	-	e0	e0
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Terminal surface	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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