Standard SRAM, 128KX8, 35ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Alliance Memory |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 35 ns |
Other features | AUTOMATIC POWER-DOWN |
JESD-30 code | R-PDIP-T32 |
JESD-609 code | e0 |
memory density | 1048576 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |
AS7C31024-35PC | AS7C31024-35TC | AS7C31024-35JC | |
---|---|---|---|
Description | Standard SRAM, 128KX8, 35ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32 |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | Alliance Memory | Alliance Memory | Alliance Memory |
Parts packaging code | DIP | TSOP1 | SOJ |
package instruction | DIP, | SOP, | SOJ, |
Contacts | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
Maximum access time | 35 ns | 35 ns | 35 ns |
Other features | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN |
JESD-30 code | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-J32 |
JESD-609 code | e0 | e0 | e0 |
memory density | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 |
word count | 131072 words | 131072 words | 131072 words |
character code | 128000 | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 128KX8 | 128KX8 | 128KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOJ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 240 | 225 |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | THROUGH-HOLE | GULL WING | J BEND |
Terminal location | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | 30 |
Base Number Matches | 1 | 1 | 1 |