IC Socket, DIP70, 70 Contact(s),
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Mill-Max |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Other features | DIP SOCKET, LOW PROFILE |
| Contact to complete cooperation | GOLD (30) OVER NICKEL (100) |
| Contact completed and terminated | Tin/Lead (Sn/Pb) |
| Contact material | NOT SPECIFIED |
| Device slot type | IC SOCKET |
| Type of equipment used | DIP70 |
| Shell material | GLASS FILLED POLYETHYLENE POLYESTER |
| JESD-609 code | e0 |
| Number of contacts | 70 |
| Base Number Matches | 1 |
| 415-93-270-41-003100 | 415-13-266-41-003100 | 415-13-268-41-003100 | 415-93-268-41-003100 | 415-93-272-41-003100 | 415-13-272-41-003100 | 415-13-270-41-003100 | 415-93-266-41-003100 | |
|---|---|---|---|---|---|---|---|---|
| Description | IC Socket, DIP70, 70 Contact(s), | IC Socket, DIP66, 66 Contact(s), | IC Socket, DIP68, 68 Contact(s), | IC Socket, DIP68, 68 Contact(s), | IC Socket, DIP72, 72 Contact(s), | IC Socket, DIP72, 72 Contact(s), | IC Socket, DIP70, 70 Contact(s), | IC Socket, DIP66, 66 Contact(s), |
| Is it lead-free? | Contains lead | Lead free | Lead free | Contains lead | Contains lead | Lead free | Lead free | Contains lead |
| Is it Rohs certified? | incompatible | conform to | conform to | incompatible | incompatible | conform to | conform to | incompatible |
| Reach Compliance Code | compliant | compli | compli | compli | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | DIP SOCKET, LOW PROFILE | DIP SOCKET, LOW PROFILE | DIP SOCKET, LOW PROFILE | DIP SOCKET, LOW PROFILE | DIP SOCKET, LOW PROFILE | DIP SOCKET, LOW PROFILE | DIP SOCKET, LOW PROFILE | DIP SOCKET, LOW PROFILE |
| Contact to complete cooperation | GOLD (30) OVER NICKEL (100) | GOLD (30) OVER NICKEL (100) | GOLD (30) OVER NICKEL (100) | GOLD (30) OVER NICKEL (100) | GOLD (30) OVER NICKEL (100) | GOLD (30) OVER NICKEL (100) | GOLD (30) OVER NICKEL (100) | GOLD (30) OVER NICKEL (100) |
| Contact completed and terminated | Tin/Lead (Sn/Pb) | Gold (Au) | Gold (Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) | Gold (Au) | Tin/Lead (Sn/Pb) |
| Contact material | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Device slot type | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET |
| Type of equipment used | DIP70 | DIP66 | DIP68 | DIP68 | DIP72 | DIP72 | DIP70 | DIP66 |
| Shell material | GLASS FILLED POLYETHYLENE POLYESTER | GLASS FILLED POLYETHYLENE POLYESTER | GLASS FILLED POLYETHYLENE POLYESTER | GLASS FILLED POLYETHYLENE POLYESTER | GLASS FILLED POLYETHYLENE POLYESTER | GLASS FILLED POLYETHYLENE POLYESTER | GLASS FILLED POLYETHYLENE POLYESTER | GLASS FILLED POLYETHYLENE POLYESTER |
| JESD-609 code | e0 | e4 | e4 | e0 | e0 | e4 | e4 | e0 |
| Number of contacts | 70 | 66 | 68 | 68 | 72 | 72 | 70 | 66 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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