IDT74ALVC162244PA datasheet, PDF

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IDT74ALVC162244PA: DescriptionBus Driver, ALVC/VCX/A Series, 4-Func, 4-Bit, True Output, CMOS, PDSO48, TSSOP-48; Categorylogic logic; File Size201KB，5 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT74ALVC162244PA Overview

Bus Driver, ALVC/VCX/A Series, 4-Func, 4-Bit, True Output, CMOS, PDSO48, TSSOP-48

IDT74ALVC162244PA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	TSSOP
package instruction	TSSOP-48
Contacts	48
Reach Compliance Code	not_compliant
Control type	ENABLE LOW
series	ALVC/VCX/A
JESD-30 code	R-PDSO-G48
JESD-609 code	e0
length	12.5 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.012 A
Humidity sensitivity level	1
Number of digits	4
Number of functions	4
Number of ports	2
Number of terminals	48
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE WITH SERIES RESISTOR
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP48,.3,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	240
power supply	3.3 V
Prop。Delay @ Nom-Sup	4.2 ns
propagation delay (tpd)	4.9 ns
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	20
width	6.1 mm
Base Number Matches	1

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Integrated Device Technology, Inc.

6024 Silver Creek Valley Road, San Jose, CA 95138

PRODUCT/PROCESS CHANGE NOTICE (PCN)

PCN #:

TB-0510-05

DATE:

14-Dec-2005

MEANS OF DISTINGUISHING CHANGED DEVICES:

Product Affected:

48L, 56L, 64L TSSOP & 80L TVSOP &

Product Mark

48L, 56L TSSOP exposed pad

Back Mark

(Green & Standard)

Date Code

Rev 07 printed on shipping tube

Date Effective:

13-Jan-2006

Other

Contact:

Title:

Phone #:

Fax #:

E-mail:

Geoffrey Cortes

Manager, Corporate Quality & Reliability

(408) 284-8321

(408) 284-1450

Geoffrey.Cortes@idt.com

Attachment:

Samples: N/A

Yes

DESCRIPTION AND PURPOSE OF CHANGE:

Die Technology

IDT will introduce a more robust shipping tube used to pack TSSOP,

Wafer Fabrication Process

TVSOP and TSSOP exposed pad packages. This change is to increase the

Assembly Process

wall thickness in order to provide better protection to the packages during

Equipment

assembly, test and back-end processes.

Material

Attachment I details the change of the shipping tube's wall thickness and

Testing

the qualification data.

Manufacturing Site

Attachment II provides the list of products affected.

Data Sheet

Other - Packaging

RELIABILITY/QUALIFICATION SUMMARY:

There is no impact with regards to the package performance or reliability.

CUSTOMER ACKNOWLEDGMENT OF RECEIPT:

IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail

to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice

it will be assumed that this change is acceptable.

IDT reserves the right to ship either version manufactured after the process change effective date until the inventory

on the earlier version has been depleted.

Customer:

Name/Date:

Title:

CUSTOMER COMMENTS:

Approval for shipments prior to effective date.

E-Mail Address:

Phone# /Fax# :

IDT ACKNOWLEDGMENT OF RECEIPT:

RECD. BY:

DATE:

IDT FRA-1509-01 REV. 00 09/18/01

Page 1 of 5

Refer To QCA-1795

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