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72T1845L6-7BBG

Description
FIFO, 2KX18, 3.8ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144
Categorystorage    storage   
File Size510KB,55 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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72T1845L6-7BBG Overview

FIFO, 2KX18, 3.8ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144

72T1845L6-7BBG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA, BGA144,12X12,40
Contacts144
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time3.8 ns
Other featuresALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
Spare memory width9
Maximum clock frequency (fCLK)66 MHz
period time6.7 ns
JESD-30 codeS-PBGA-B144
JESD-609 codee1
length13 mm
memory density36864 bit
Memory IC TypeOTHER FIFO
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals144
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX18
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA144,12X12,40
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5 V
Certification statusNot Qualified
Maximum seat height1.97 mm
Maximum standby current0.05 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width13 mm
Base Number Matches1
2.5 VOLT HIGH-SPEED TeraSync™ FIFO
IDT72T1845, IDT72T1855
18-BIT/9-BIT CONFIGURATIONS
IDT72T1865, IDT72T1875
2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9, 8,192 x 18/16,384 x 9,
IDT72T1885, IDT72T1895
16,384 x 18/32,768 x 9, 32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9,
IDT72T18105, IDT72T18115
131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9, 524,288 x 18/1,048,576 x 9
IDT72T18125
FEATURES:
Choose among the following memory organizations:
IDT72T1845
2,048 x 18/4,096 x 9
IDT72T1855
4,096 x 18/8,192 x 9
IDT72T1865
8,192 x 18/16,384 x 9
IDT72T1875
16,384 x 18/32,768 x 9
IDT72T1885
32,768 x 18/65,536 x 9
IDT72T1895
65,536 x 18/131,072 x 9
IDT72T18105
131,072 x 18/262,144 x 9
IDT72T18115
262,144 x 18/524,288 x 9
IDT72T18125
524,288 x 18/1,048,576 x 9
Up to 225 MHz Operation of Clocks
User selectable HSTL/LVTTL Input and/or Output
Read Enable & Read Clock Echo outputs aid high speed operation
User selectable Asynchronous read and/or write port timing
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input enables/disables Write operations
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 144-pin (13mm x 13mm) or 240-pin (19mm x 19mm)
PlasticBall Grid Array (PBGA)
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts are available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
D
0
-D
n
(x18 or x9)
WEN
WCLK/WR
WCS
LD
SEN
SCLK
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
2,048 x 18 or 4,096 x 9
4,096 x 18 or 8,192 x 9
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
32,768 x 18 or 65,536 x 9
65,536 x 18 or 131,072 x 9
131,072 x 18 or 262,144 x 9
262,144 x 18 or 524,288 x 9
524,288 x 18 or 1,048,576 x 9
FLAG
LOGIC
WRITE POINTER
BE
IP
IW
OW
MRS
PRS
TCK
TRST
TMS
TDO
TDI
Vref
WHSTL
RHSTL
SHSTL
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
READ POINTER
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
MARK
ASYR
JTAG CONTROL
(BOUNDARY SCAN)
RCLK/RD
REN
RCS
HSTL I/0
CONTROL
OE
EREN
5909 drw01
Q
0
-Q
n
(x18 or x9)
ERCLK
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
FEBRUARY 2009
DSC-5909/19

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