Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CQCC28, CERAMIC, LCC-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | QLCC |
package instruction | QCCN, LCC28,.45SQ |
Contacts | 28 |
Reach Compliance Code | unknown |
series | F/FAST |
JESD-30 code | S-CQCC-N28 |
JESD-609 code | e0 |
length | 11.43 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | ARITHMETIC LOGIC UNIT |
Number of digits | 4 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC28,.45SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Maximum supply current (ICC) | 65 mA |
propagation delay (tpd) | 15 ns |
Certification status | Not Qualified |
Maximum seat height | 1.905 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 11.43 mm |
Base Number Matches | 1 |
54F181LM | 54F181LMQB | 54F181DM | 54F181SDM | 54F181FMQB | 54F181DMQB | 54F181FM | 54F181SDMQB | |
---|---|---|---|---|---|---|---|---|
Description | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CQCC28, CERAMIC, LCC-28 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CQCC28, CERAMIC, LCC-28 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, CERAMIC, DIP-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDFP24, CERPACK-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, CERAMIC, DIP-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDFP24, CERPACK-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, 0.300 INCH, CERAMIC, DIP-24 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | QLCC | QLCC | DIP | DIP | DFP | DIP | DFP | DIP |
package instruction | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIP, DIP24,.6 | DIP, DIP24,.3 | DFP, FL24,.4 | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.3 |
Contacts | 28 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead | - |
series | F/FAST | F/FAST | F/FAST | - | F/FAST | F/FAST | F/FAST | - |
JESD-30 code | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 | - | R-GDFP-F24 | R-GDIP-T24 | R-GDFP-F24 | - |
JESD-609 code | e0 | e0 | e0 | - | e0 | e0 | e0 | - |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | - |
Logic integrated circuit type | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | - | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | - |
Number of digits | 4 | 4 | 4 | - | 4 | 4 | 4 | - |
Number of functions | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
Number of terminals | 28 | 28 | 24 | - | 24 | 24 | 24 | - |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | - |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | - |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
encapsulated code | QCCN | QCCN | DIP | - | DFP | DIP | DFP | - |
Encapsulate equivalent code | LCC28,.45SQ | LCC28,.45SQ | DIP24,.6 | - | FL24,.4 | DIP24,.6 | FL24,.4 | - |
Package shape | SQUARE | SQUARE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
Package form | CHIP CARRIER | CHIP CARRIER | IN-LINE | - | FLATPACK | IN-LINE | FLATPACK | - |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
power supply | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
Maximum supply current (ICC) | 65 mA | 65 mA | 65 mA | - | 65 mA | 65 mA | 65 mA | - |
propagation delay (tpd) | 15 ns | 15 ns | 15 ns | - | 15 ns | 15 ns | 15 ns | - |
Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
Maximum seat height | 1.905 mm | 1.905 mm | 4.572 mm | - | 2.286 mm | 4.572 mm | 2.286 mm | - |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
surface mount | YES | YES | NO | - | YES | NO | YES | - |
technology | TTL | TTL | TTL | - | TTL | TTL | TTL | - |
Temperature level | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Terminal form | NO LEAD | NO LEAD | THROUGH-HOLE | - | FLAT | THROUGH-HOLE | FLAT | - |
Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | - |
Terminal location | QUAD | QUAD | DUAL | - | DUAL | DUAL | DUAL | - |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |