Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.6 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Other features | CAPABLE OF 16 LOGIC AND ARITHMETIC OPERATIONS |
| series | F/FAST |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | ARITHMETIC LOGIC UNIT |
| Number of digits | 4 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 65 mA |
| propagation delay (tpd) | 15 ns |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| 54F181DM | 54F181LMQB | 54F181SDM | 54F181FMQB | 54F181LM | 54F181DMQB | 54F181FM | 54F181SDMQB | |
|---|---|---|---|---|---|---|---|---|
| Description | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, CERAMIC, DIP-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CQCC28, CERAMIC, LCC-28 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDFP24, CERPACK-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CQCC28, CERAMIC, LCC-28 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, CERAMIC, DIP-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDFP24, CERPACK-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, 0.300 INCH, CERAMIC, DIP-24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | QLCC | DIP | DFP | QLCC | DIP | DFP | DIP |
| package instruction | DIP, DIP24,.6 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DFP, FL24,.4 | QCCN, LCC28,.45SQ | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.3 |
| Contacts | 24 | 28 | 24 | 24 | 28 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Is it lead-free? | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead | Contains lead | - |
| series | F/FAST | F/FAST | - | F/FAST | F/FAST | F/FAST | F/FAST | - |
| JESD-30 code | R-GDIP-T24 | S-CQCC-N28 | - | R-GDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | R-GDFP-F24 | - |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 | e0 | - |
| Load capacitance (CL) | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | - |
| Logic integrated circuit type | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | - | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | - |
| Number of digits | 4 | 4 | - | 4 | 4 | 4 | 4 | - |
| Number of functions | 1 | 1 | - | 1 | 1 | 1 | 1 | - |
| Number of terminals | 24 | 28 | - | 24 | 28 | 24 | 24 | - |
| Maximum operating temperature | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | - |
| Minimum operating temperature | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| encapsulated code | DIP | QCCN | - | DFP | QCCN | DIP | DFP | - |
| Encapsulate equivalent code | DIP24,.6 | LCC28,.45SQ | - | FL24,.4 | LCC28,.45SQ | DIP24,.6 | FL24,.4 | - |
| Package shape | RECTANGULAR | SQUARE | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | CHIP CARRIER | - | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | - |
| Maximum supply current (ICC) | 65 mA | 65 mA | - | 65 mA | 65 mA | 65 mA | 65 mA | - |
| propagation delay (tpd) | 15 ns | 15 ns | - | 15 ns | 15 ns | 15 ns | 15 ns | - |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | 4.572 mm | 1.905 mm | - | 2.286 mm | 1.905 mm | 4.572 mm | 2.286 mm | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | - |
| surface mount | NO | YES | - | YES | YES | NO | YES | - |
| technology | TTL | TTL | - | TTL | TTL | TTL | TTL | - |
| Temperature level | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | NO LEAD | - | FLAT | NO LEAD | THROUGH-HOLE | FLAT | - |
| Terminal pitch | 2.54 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | - |
| Terminal location | DUAL | QUAD | - | DUAL | QUAD | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
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