GS8170DD18C-333IT datasheet, PDF

GS8170DD18C-333IT: DescriptionStandard SRAM, 1MX18, 1.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209; Categorystorage storage; File Size826KB，31 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS8170DD18C-333IT Overview

Standard SRAM, 1MX18, 1.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA,
Contacts	209
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	1.6 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B209
length	22 mm
memory density	18874368 bit
Memory IC Type	STANDARD SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of terminals	209
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX18
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.7 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
Base Number Matches	1

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