BR24G02FVJ-3AGTE2 datasheet, PDF

BR24G02FVJ-3AGTE2: DescriptionEEPROM I2C BUS 2K(256x8bit) EEPROM; Categorystorage storage; File Size829KB，37 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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EEPROM I2C BUS 2K(256x8bit) EEPROM

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
package instruction	TSSOP,
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	10 weeks
Maximum clock frequency (fCLK)	1 MHz
JESD-30 code	S-PDSO-G8
length	3 mm
memory density	2048 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	256 words
character code	256
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256X8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	1.1 mm
Serial bus type	I2C
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm
Maximum write cycle time (tWC)	5 ms

	BR24G02FVJ-3AGTE2	BR24G02NUX-3ATTR	BR24G02FJ-3AGTE2
Description	EEPROM I2C BUS 2K(256x8bit) EEPROM	EEPROM I2C BUS 2K(256x8bit) EEPROM	EEPROM I2C BUS 2Kbit(256x8bit) EEPROM
Is it Rohs certified?	conform to	-	conform to
Maker	ROHM Semiconductor	-	ROHM Semiconductor
package instruction	TSSOP,	-	LSOP,
Reach Compliance Code	compliant	-	compliant
Factory Lead Time	10 weeks	-	11 weeks
Maximum clock frequency (fCLK)	1 MHz	-	1 MHz
JESD-30 code	S-PDSO-G8	-	R-PDSO-G8
length	3 mm	-	4.9 mm
memory density	2048 bit	-	2048 bit
Memory IC Type	EEPROM	-	EEPROM
memory width	8	-	8
Number of functions	1	-	1
Number of terminals	8	-	8
word count	256 words	-	256 words
character code	256	-	256
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS
Maximum operating temperature	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-	-40 °C
organize	256X8	-	256X8
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	TSSOP	-	LSOP
Package shape	SQUARE	-	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, LOW PROFILE
Parallel/Serial	SERIAL	-	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED
Maximum seat height	1.1 mm	-	1.65 mm
Serial bus type	I2C	-	I2C
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V
Minimum supply voltage (Vsup)	1.7 V	-	1.7 V
Nominal supply voltage (Vsup)	2.5 V	-	2.5 V
surface mount	YES	-	YES
technology	CMOS	-	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL
Terminal form	GULL WING	-	GULL WING
Terminal pitch	0.65 mm	-	1.27 mm
Terminal location	DUAL	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED
width	3 mm	-	3.9 mm
Maximum write cycle time (tWC)	5 ms	-	5 ms

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