|
BR24G02NUX-3ATTR |
BR24G02FVJ-3AGTE2 |
BR24G02FJ-3AGTE2 |
Description |
EEPROM I2C BUS 2K(256x8bit) EEPROM |
EEPROM I2C BUS 2K(256x8bit) EEPROM |
EEPROM I2C BUS 2Kbit(256x8bit) EEPROM |
Is it Rohs certified? |
- |
conform to |
conform to |
Maker |
- |
ROHM Semiconductor |
ROHM Semiconductor |
package instruction |
- |
TSSOP, |
LSOP, |
Reach Compliance Code |
- |
compliant |
compliant |
Factory Lead Time |
- |
10 weeks |
11 weeks |
Maximum clock frequency (fCLK) |
- |
1 MHz |
1 MHz |
JESD-30 code |
- |
S-PDSO-G8 |
R-PDSO-G8 |
length |
- |
3 mm |
4.9 mm |
memory density |
- |
2048 bit |
2048 bit |
Memory IC Type |
- |
EEPROM |
EEPROM |
memory width |
- |
8 |
8 |
Number of functions |
- |
1 |
1 |
Number of terminals |
- |
8 |
8 |
word count |
- |
256 words |
256 words |
character code |
- |
256 |
256 |
Operating mode |
- |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
- |
85 °C |
85 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
organize |
- |
256X8 |
256X8 |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
TSSOP |
LSOP |
Package shape |
- |
SQUARE |
RECTANGULAR |
Package form |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE |
Parallel/Serial |
- |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
Maximum seat height |
- |
1.1 mm |
1.65 mm |
Serial bus type |
- |
I2C |
I2C |
Maximum supply voltage (Vsup) |
- |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
- |
1.7 V |
1.7 V |
Nominal supply voltage (Vsup) |
- |
2.5 V |
2.5 V |
surface mount |
- |
YES |
YES |
technology |
- |
CMOS |
CMOS |
Temperature level |
- |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
- |
GULL WING |
GULL WING |
Terminal pitch |
- |
0.65 mm |
1.27 mm |
Terminal location |
- |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
width |
- |
3 mm |
3.9 mm |
Maximum write cycle time (tWC) |
- |
5 ms |
5 ms |