2 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDIP8, PLASTIC, DIP-8
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Maker | Rochester Electronics |
Parts packaging code | DIP |
package instruction | , |
Contacts | 8 |
Reach Compliance Code | unknown |
high side driver | NO |
Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e0 |
Humidity sensitivity level | NOT APPLICABLE |
Number of functions | 2 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Nominal output peak current | 2 A |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | COMMERCIAL |
Maximum supply voltage | 15 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 15 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Disconnect time | 0.025 µs |
connection time | 0.025 µs |
Base Number Matches | 1 |
EL7212CN | EL7212CS | EL7222CN | EL7202CN | EL7212CS-T7 | EL7222CS | EL7202CS | |
---|---|---|---|---|---|---|---|
Description | 2 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDIP8, PLASTIC, DIP-8 | 2 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, SO-8 | 2 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDIP8, PLASTIC, DIP-8 | 2 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDIP8, PLASTIC, DIP-8 | 2 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, SO-8 | 2 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, SO-8 | 2 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8, SO-8 |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Parts packaging code | DIP | SOIC | DIP | DIP | SOIC | SOIC | SOIC |
package instruction | , | SOP, | , | , | SOP, | SOP, | SOP, |
Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
high side driver | NO | NO | NO | NO | NO | NO | NO |
Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
JESD-30 code | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Nominal output peak current | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Maximum supply voltage | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
surface mount | NO | YES | NO | NO | YES | YES | YES |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Disconnect time | 0.025 µs | 0.025 µs | 0.025 µs | 0.025 µs | 0.025 µs | 0.025 µs | 0.025 µs |
connection time | 0.025 µs | 0.025 µs | 0.025 µs | 0.025 µs | 0.025 µs | 0.025 µs | 0.025 µs |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead |
JESD-609 code | e0 | e0 | e0 | - | e0 | e0 | e0 |
Humidity sensitivity level | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | - | 1 | NOT APPLICABLE | 1 |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | 240 | NOT SPECIFIED | 240 |
technology | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
encapsulated code | - | SOP | - | - | SOP | SOP | SOP |