M24C04-BN6 datasheet, PDF - EEWORLD Datasheet

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M24C04-BN6: DescriptionEEPROM E-EPROM; Categorystorage storage; File Size505KB，34 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M24C04-BN6 Overview

EEPROM E-EPROM

M24C04-BN6 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	PLASTIC, DIP-8
Contacts	8
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDMR
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.27 mm
memory density	4096 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512X8
Output characteristics	OPEN-DRAIN
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.33 mm
Serial bus type	I2C
Maximum standby current	0.000001 A
Maximum slew rate	0.002 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE
Base Number Matches	1

M24C04-BN6 Related Products

	M24C04-BN6	M24C04-FMB5TG	M24C04-MN6T
Description	EEPROM E-EPROM	EEPROM EEPROM S I2C 4k	EEPROM 5.5V 4K (512x8)
Is it Rohs certified?	incompatible	conform to	incompatible
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	DIP	SOIC	SOIC
package instruction	PLASTIC, DIP-8	2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8	0.150 INCH, PLASTIC, SO-8
Contacts	8	8	8
Reach Compliance Code	not_compliant	compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz
Data retention time - minimum	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	1010DDMR	1010DDMR	1010DDMR
JESD-30 code	R-PDIP-T8	R-PDSO-N8	R-PDSO-G8
JESD-609 code	e0	e4	e0
length	9.27 mm	3 mm	4.9 mm
memory density	4096 bit	4096 bit	4096 bit
Memory IC Type	EEPROM	EEPROM	EEPROM
memory width	8	8	8
Number of functions	1	1	1
Number of terminals	8	8	8
word count	512 words	512 words	512 words
character code	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-20 °C	-40 °C
organize	512X8	512X8	512X8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	HVSON	SOP
Encapsulate equivalent code	DIP8,.3	SOLCC8,.11,20	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	NOT SPECIFIED
power supply	5 V	1.8/5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.33 mm	0.6 mm	1.75 mm
Serial bus type	I2C	I2C	I2C
Maximum standby current	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	0.002 mA	0.0008 mA	0.002 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	1.7 V	4.5 V
Nominal supply voltage (Vsup)	5 V	2.5 V	5 V
surface mount	NO	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	NICKEL PALLADIUM GOLD	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	NO LEAD	GULL WING
Terminal pitch	2.54 mm	0.5 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	30	NOT SPECIFIED
width	7.62 mm	2 mm	3.9 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms
write protect	HARDWARE	HARDWARE	HARDWARE
Output characteristics	OPEN-DRAIN	-	OPEN-DRAIN

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