|
M24C04-FMB5TG |
M24C04-BN6 |
M24C04-MN6T |
Description |
EEPROM EEPROM S I2C 4k |
EEPROM E-EPROM |
EEPROM 5.5V 4K (512x8) |
Is it Rohs certified? |
conform to |
incompatible |
incompatible |
Maker |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
Parts packaging code |
SOIC |
DIP |
SOIC |
package instruction |
2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8 |
PLASTIC, DIP-8 |
0.150 INCH, PLASTIC, SO-8 |
Contacts |
8 |
8 |
8 |
Reach Compliance Code |
compliant |
not_compliant |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Maximum clock frequency (fCLK) |
0.4 MHz |
0.4 MHz |
0.4 MHz |
Data retention time - minimum |
40 |
40 |
40 |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
I2C control byte |
1010DDMR |
1010DDMR |
1010DDMR |
JESD-30 code |
R-PDSO-N8 |
R-PDIP-T8 |
R-PDSO-G8 |
JESD-609 code |
e4 |
e0 |
e0 |
length |
3 mm |
9.27 mm |
4.9 mm |
memory density |
4096 bit |
4096 bit |
4096 bit |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
memory width |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
word count |
512 words |
512 words |
512 words |
character code |
512 |
512 |
512 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-20 °C |
-40 °C |
-40 °C |
organize |
512X8 |
512X8 |
512X8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVSON |
DIP |
SOP |
Encapsulate equivalent code |
SOLCC8,.11,20 |
DIP8,.3 |
SOP8,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
IN-LINE |
SMALL OUTLINE |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
1.8/5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
0.6 mm |
5.33 mm |
1.75 mm |
Serial bus type |
I2C |
I2C |
I2C |
Maximum standby current |
0.000001 A |
0.000001 A |
0.000001 A |
Maximum slew rate |
0.0008 mA |
0.002 mA |
0.002 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
1.7 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
2.5 V |
5 V |
5 V |
surface mount |
YES |
NO |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
OTHER |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
NICKEL PALLADIUM GOLD |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
NO LEAD |
THROUGH-HOLE |
GULL WING |
Terminal pitch |
0.5 mm |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
width |
2 mm |
7.62 mm |
3.9 mm |
Maximum write cycle time (tWC) |
5 ms |
5 ms |
5 ms |
write protect |
HARDWARE |
HARDWARE |
HARDWARE |
Output characteristics |
- |
OPEN-DRAIN |
OPEN-DRAIN |