EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AA-02-3741-F

Description
Resistor Networks u0026 Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AA-02-3741-F Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AA-02-3741-F - - View Buy Now

WBC-B0202AA-02-3741-F Overview

Resistor Networks u0026 Arrays

WBC-B0202AA-02-3741-F Parametric

Parameter NameAttribute value
Product CategoryResistor Networks & Arrays
ManufacturerTT Electronics plc
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
ADI New Chinese Information (November 2019)
The ADI Chinese materials that everyone has been looking forward to in November are here, including data sheets, system solutions, videos, analog dialogues...all available! Click[Get information]Data ...
EEWORLD社区 ADI Reference Circuit
[GD32F310 Review] The board has not yet arrived, so we will distribute it first
Motor drive resource planning According to the previous plan, it should be ensured that the chip has the ability to drive a three-phase bridge and determine the IO allocation of the chip. The chip sig...
javnson GD32 MCU
[NUCLEO-L552ZE Review] +Serial port printing is finally successful!
I posted a thread before asking for help with serial port printing. Because I have been using MDK+standard library, and recently I just learned the CUBE+HAL library, so I just took this board to pract...
eew_RZBDDH stm32/stm8
Today at 10:00 am TI Award Live: Low-power wireless technology for building automation sensor applications
Today at 10:00 am TI Award Live: Low-power wireless technology for building automation sensor applicationsClick here to enter the live broadcastLive broadcast time: March 10, 10:00-11:30 am Live Topic...
EEWORLD社区 TI Technology Forum
For SMD components with thin pins, what should be the PCB wiring line width?
In the past, I made direct-insert PCBs. I usually set the line width of the power and ground lines to 50 mils, and the other lines to 30 mils. Now I want to make a PCB with both SMD and direct-insert ...
lcwd PCB Design
EEWORLD University Hall----Live Replay: TI Sitara? Latest AM64X Platform Introduction
Live replay: TI Sitara? Latest AM64X platform introduction : https://training.eeworld.com.cn/course/6089...
hi5 Integrated technical exchanges

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号