USB Interface IC USB to Serial UART Enhanced IC SSOP-28
Parameter Name | Attribute value |
Brand Name | Freescale |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | LCC |
package instruction | PLASTIC, LCC-44 |
Contacts | 44 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Has ADC | NO |
Other features | OPERATES AT 3.3V SUPPLY @ 1 MHZ |
Address bus width | |
bit size | 8 |
CPU series | 6805 |
maximum clock frequency | 4.2 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | |
JESD-30 code | S-PQCC-J44 |
JESD-609 code | e3 |
length | 16.5862 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 31 |
Number of terminals | 44 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC44,.7SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | 250 |
power supply | 3.3/5 V |
Certification status | Not Qualified |
RAM (bytes) | 176 |
rom(word) | 7744 |
ROM programmability | OTPROM |
Maximum seat height | 4.57 mm |
speed | 2.1 MHz |
Maximum slew rate | 7 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | HCMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 16.5862 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
Base Number Matches | 1 |
MC68HC705C8ACFNE | 935322581574 | 935325158557 | 935318962174 | MC68HC705C8ACFN | MC68HC705C8ACP | MC68HC705C8ACFB | MC68HC705C8AB | MC68HC705C8AVFNE | |
---|---|---|---|---|---|---|---|---|---|
Description | USB Interface IC USB to Serial UART Enhanced IC SSOP-28 | Microcontroller | Microcontroller | Microcontroller | IC MCU 8BIT 8KB OTP 44PLCC | IC MCU 8BIT 8KB OTP 40DIP | IC MCU 8BIT 8KB OTP 44QFP | IC MCU 8BIT 8KB OTP 42PSDIP | IC MCU 8BIT 8KB OTP 44PLCC |
Maker | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
Reach Compliance Code | unknown | unknown | unknown | unknown | not_compliant | unknown | not_compliant | not_compliant | compliant |
Has ADC | NO | YES | YES | YES | NO | NO | NO | NO | NO |
bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
maximum clock frequency | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4 MHz |
DMA channel | NO | NO | NO | NO | NO | NO | NO | NO | NO |
length | 16.5862 mm | 16.5862 mm | 10 mm | 52.07 mm | 16.5862 mm | 52.07 mm | 10 mm | 36.83 mm | 16.585 mm |
Number of I/O lines | 31 | 31 | 31 | 31 | 31 | 31 | 31 | 31 | 24 |
Number of terminals | 44 | 44 | 44 | 40 | 44 | 40 | 44 | 42 | 44 |
PWM channel | NO | NO | NO | NO | NO | NO | NO | NO | NO |
encapsulated code | QCCJ | QCC | LQFP | DIP | QCCJ | DIP | QFP | SDIP | QCCJ |
Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | IN-LINE, SHRINK PITCH | CHIP CARRIER |
speed | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 4 MHz |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | NO | YES | NO | YES | NO | YES |
Terminal form | J BEND | J BEND | GULL WING | THROUGH HOLE | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm | 0.8 mm | 2.54 mm | 1.27 mm | 2.54 mm | 0.8 mm | 1.778 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD |
width | 16.5862 mm | 16.5862 mm | 10 mm | 13.97 mm | 16.5862 mm | 15.24 mm | 10 mm | 15.24 mm | 16.585 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Is it Rohs certified? | conform to | - | - | - | incompatible | incompatible | incompatible | incompatible | conform to |
Parts packaging code | LCC | - | - | - | LCC | DIP | QFP | DIP | LCC |
package instruction | PLASTIC, LCC-44 | QCC, | LQFP, | - | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | QFP, QFP44,.5SQ,32 | PLASTIC, SDIP-42 | QCCJ, |
Contacts | 44 | - | - | - | 44 | 40 | 44 | 42 | 44 |
ECCN code | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Other features | OPERATES AT 3.3V SUPPLY @ 1 MHZ | - | - | - | OPERATES AT 3.3V SUPPLY @ 1 MHZ | OPERATES AT 3.3V SUPPLY @ 1 MHZ | OPERATES AT 3.3V SUPPLY @ 1 MHZ | OPERATES AT 3V MINIMUM SUPPLY @ 1 MHZ | - |
CPU series | 6805 | - | - | - | 6805 | 6805 | 6805 | 6805 | - |
DAC channel | NO | - | - | - | NO | NO | NO | NO | NO |
JESD-30 code | S-PQCC-J44 | - | - | - | S-PQCC-J44 | R-PDIP-T40 | S-PQFP-G44 | R-PDIP-T42 | S-PQCC-J44 |
JESD-609 code | e3 | - | - | - | e0 | e0 | e0 | e0 | e3 |
Maximum operating temperature | 85 °C | - | - | - | 85 °C | 85 °C | 85 °C | 70 °C | 105 °C |
Minimum operating temperature | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C | - | -40 °C |
Package body material | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Encapsulate equivalent code | LDCC44,.7SQ | - | - | - | LDCC44,.7SQ | DIP40,.6 | QFP44,.5SQ,32 | SDIP42,.6 | - |
Peak Reflow Temperature (Celsius) | 250 | - | - | - | NOT SPECIFIED | NOT SPECIFIED | 220 | NOT SPECIFIED | 220 |
power supply | 3.3/5 V | - | - | - | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | - |
Certification status | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 176 | - | - | - | 176 | 176 | 176 | 176 | - |
rom(word) | 7744 | - | - | - | 7744 | 7744 | 7744 | 7744 | - |
ROM programmability | OTPROM | - | - | - | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM |
Maximum seat height | 4.57 mm | - | - | - | 4.57 mm | 5.08 mm | 2.45 mm | 5.08 mm | 4.57 mm |
Maximum slew rate | 7 mA | - | - | - | 7 mA | 7 mA | 7 mA | 7 mA | - |
technology | HCMOS | - | - | - | HCMOS | HCMOS | HCMOS | HCMOS | HCMOS |
Temperature level | INDUSTRIAL | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
Maximum time at peak reflow temperature | 30 | - | - | - | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 |
Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | - | - | - |