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935325158557

Description
Microcontroller
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,222 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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935325158557 Overview

Microcontroller

935325158557 Parametric

Parameter NameAttribute value
MakerNXP
package instructionLQFP,
Reach Compliance Codeunknown
Has ADCYES
Address bus width
bit size8
maximum clock frequency4.2 MHz
DMA channelNO
External data bus width
length10 mm
Number of I/O lines31
Number of terminals44
PWM channelNO
encapsulated codeLQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
speed2.1 MHz
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width10 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Base Number Matches1
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
MC68HC705C8A
MC68HSC705C8A
Technical Data
M68HC05
Microcontrollers
MC68HC705C8A/D
Rev. 3, 3/2002
For More Information On This Product,
Go to: www.freescale.com

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Description Microcontroller Microcontroller USB Interface IC USB to Serial UART Enhanced IC SSOP-28 Microcontroller IC MCU 8BIT 8KB OTP 44PLCC IC MCU 8BIT 8KB OTP 40DIP IC MCU 8BIT 8KB OTP 44QFP IC MCU 8BIT 8KB OTP 42PSDIP IC MCU 8BIT 8KB OTP 44PLCC
Maker NXP NXP NXP NXP NXP NXP NXP NXP NXP
Reach Compliance Code unknown unknown unknown unknown not_compliant unknown not_compliant not_compliant compliant
Has ADC YES YES NO YES NO NO NO NO NO
bit size 8 8 8 8 8 8 8 8 8
maximum clock frequency 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz 4 MHz
DMA channel NO NO NO NO NO NO NO NO NO
length 10 mm 16.5862 mm 16.5862 mm 52.07 mm 16.5862 mm 52.07 mm 10 mm 36.83 mm 16.585 mm
Number of I/O lines 31 31 31 31 31 31 31 31 24
Number of terminals 44 44 44 40 44 40 44 42 44
PWM channel NO NO NO NO NO NO NO NO NO
encapsulated code LQFP QCC QCCJ DIP QCCJ DIP QFP SDIP QCCJ
Package shape SQUARE SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR SQUARE
Package form FLATPACK, LOW PROFILE CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE FLATPACK IN-LINE, SHRINK PITCH CHIP CARRIER
speed 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz 4 MHz
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO YES NO YES NO YES
Terminal form GULL WING J BEND J BEND THROUGH HOLE J BEND THROUGH-HOLE GULL WING THROUGH-HOLE J BEND
Terminal pitch 0.8 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 0.8 mm 1.778 mm 1.27 mm
Terminal location QUAD QUAD QUAD DUAL QUAD DUAL QUAD DUAL QUAD
width 10 mm 16.5862 mm 16.5862 mm 13.97 mm 16.5862 mm 15.24 mm 10 mm 15.24 mm 16.585 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
package instruction LQFP, QCC, PLASTIC, LCC-44 - QCCJ, LDCC44,.7SQ DIP, DIP40,.6 QFP, QFP44,.5SQ,32 PLASTIC, SDIP-42 QCCJ,
Base Number Matches 1 1 1 1 - 1 - - -
Is it Rohs certified? - - conform to - incompatible incompatible incompatible incompatible conform to
Parts packaging code - - LCC - LCC DIP QFP DIP LCC
Contacts - - 44 - 44 40 44 42 44
ECCN code - - EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
Other features - - OPERATES AT 3.3V SUPPLY @ 1 MHZ - OPERATES AT 3.3V SUPPLY @ 1 MHZ OPERATES AT 3.3V SUPPLY @ 1 MHZ OPERATES AT 3.3V SUPPLY @ 1 MHZ OPERATES AT 3V MINIMUM SUPPLY @ 1 MHZ -
CPU series - - 6805 - 6805 6805 6805 6805 -
DAC channel - - NO - NO NO NO NO NO
JESD-30 code - - S-PQCC-J44 - S-PQCC-J44 R-PDIP-T40 S-PQFP-G44 R-PDIP-T42 S-PQCC-J44
JESD-609 code - - e3 - e0 e0 e0 e0 e3
Maximum operating temperature - - 85 °C - 85 °C 85 °C 85 °C 70 °C 105 °C
Minimum operating temperature - - -40 °C - -40 °C -40 °C -40 °C - -40 °C
Package body material - - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Encapsulate equivalent code - - LDCC44,.7SQ - LDCC44,.7SQ DIP40,.6 QFP44,.5SQ,32 SDIP42,.6 -
Peak Reflow Temperature (Celsius) - - 250 - NOT SPECIFIED NOT SPECIFIED 220 NOT SPECIFIED 220
power supply - - 3.3/5 V - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V -
Certification status - - Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) - - 176 - 176 176 176 176 -
rom(word) - - 7744 - 7744 7744 7744 7744 -
ROM programmability - - OTPROM - OTPROM OTPROM OTPROM OTPROM OTPROM
Maximum seat height - - 4.57 mm - 4.57 mm 5.08 mm 2.45 mm 5.08 mm 4.57 mm
Maximum slew rate - - 7 mA - 7 mA 7 mA 7 mA 7 mA -
technology - - HCMOS - HCMOS HCMOS HCMOS HCMOS HCMOS
Temperature level - - INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface - - Matte Tin (Sn) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn)
Maximum time at peak reflow temperature - - 30 - NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED 30

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