Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Winbond(华邦电子) |
Parts packaging code | SOIC |
package instruction | SOP, SOP8,.3 |
Contacts | 8 |
Reach Compliance Code | compliant |
Samacsys Description | NOR Flash spiFlash, 64M-bit, 4Kb Uniform Sector |
Maximum clock frequency (fCLK) | 104 MHz |
Data retention time - minimum | 20 |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | S-PDSO-G8 |
JESD-609 code | e3 |
length | 5.28 mm |
memory density | 67108864 bit |
Memory IC Type | FLASH |
memory width | 1 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 67108864 words |
character code | 64000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 64MX1 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.3 |
Package shape | SQUARE |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.8 V |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
Maximum seat height | 2.16 mm |
Serial bus type | SPI |
Maximum standby current | 0.00002 A |
Maximum slew rate | 0.025 mA |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.65 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NOR TYPE |
width | 5.28 mm |
write protect | HARDWARE/SOFTWARE |