Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | BGA |
package instruction | LFBGA, BGA114,6X19,32 |
Contacts | 114 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Factory Lead Time | 1 week |
series | SSTV |
JESD-30 code | R-PBGA-B114 |
JESD-609 code | e1 |
length | 16 mm |
Logic integrated circuit type | D FLIP-FLOP |
Maximum Frequency@Nom-Su | 200000000 Hz |
MaximumI(ol) | 0.02 A |
Humidity sensitivity level | 3 |
Number of digits | 24 |
Number of functions | 1 |
Number of terminals | 114 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA114,6X19,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
method of packing | TR |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2.5 V |
Prop。Delay @ Nom-Su | 3.1 ns |
propagation delay (tpd) | 3.1 ns |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage (Vsup) | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Trigger type | POSITIVE EDGE |
width | 5.5 mm |
minfmax | 200 MHz |
Base Number Matches | 1 |