datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Analog mixed-signal IC> Amplifier circuit> LM124
PDF
Preview

LM124

Description

Basic information of LM124 amplifier:

LM124 is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are 0.058 X 0.063 INCH, DIE-14

LM124 amplifier core information:

The minimum operating temperature of the LM124 is -55 °C and the maximum operating temperature is 125 °C. Its maximum average bias current is 0.3 µA

The maximum slew rate of LM124 given by the manufacturer is 3 mA. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the LM124 gain becomes 0.707 times the low-frequency gain. The frequency is 1000 kHz.

The nominal supply voltage of the LM124 is 5 V. The input offset voltage of LM124 is 7000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of LM124:

LM124 has 14 terminals. Its terminal position type is: UPPER. Total pins: 14

LM124 amplifier additional information:

Its temperature grade is: MILITARY. The corresponding JESD-30 code is: R-XUUC-N14. The package code of LM124 is: DIE. The materials used in the LM124 package are mostly UNSPECIFIED. The package shape is RECTANGULAR.

The LM124 package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.

CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size219KB，5 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Alternative parts：LM124
Download Datasheet Parametric Compare View All

LM124 Overview

Basic information of LM124 amplifier:

LM124 is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are 0.058 X 0.063 INCH, DIE-14

LM124 amplifier core information:

The minimum operating temperature of the LM124 is -55 °C and the maximum operating temperature is 125 °C. Its maximum average bias current is 0.3 µA

The maximum slew rate of LM124 given by the manufacturer is 3 mA. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the LM124 gain becomes 0.707 times the low-frequency gain. The frequency is 1000 kHz.

The nominal supply voltage of the LM124 is 5 V. The input offset voltage of LM124 is 7000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of LM124:

LM124 has 14 terminals. Its terminal position type is: UPPER. Total pins: 14

LM124 amplifier additional information:

Its temperature grade is: MILITARY. The corresponding JESD-30 code is: R-XUUC-N14. The package code of LM124 is: DIE. The materials used in the LM124 package are mostly UNSPECIFIED. The package shape is RECTANGULAR.

The LM124 package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.

LM124 Parametric

Parameter NameAttribute value
Parts packaging codeDIE
package instruction0.058 X 0.063 INCH, DIE-14
Contacts14
Reach Compliance Codeunknown
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
Maximum average bias current (IIB)0.3 µA
Nominal Common Mode Rejection Ratio85 dB
Maximum input offset voltage7000 µV
JESD-30 codeR-XUUC-N14
Number of functions4
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
Certification statusNot Qualified
Maximum slew rate3 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyBIPOLAR
Temperature levelMILITARY
Terminal formNO LEAD
Terminal locationUPPER
Nominal Uniform Gain Bandwidth1000 kHz
Base Number Matches1

Preview

Download Datasheet
This Material Copyrighted By Its Respective Manufacturer

LM124 Related Products

LM124 LM324AN LM124AF LM224AD LM224D LM324A LM124AD LM324D LD124A LM324AD
Description Operational Amplifier, 4 Func, 7000uV Offset-Max, BIPolar, 0.058 X 0.063 INCH, DIE-14 Operational Amplifier, 4 Func, 5000uV Offset-Max, BIPolar, PDIP14, PLASTIC, TO-116, DIP-14 Operational Amplifier, 4 Func, 4000uV Offset-Max, BIPolar, CDFP14, CERPACK-14 Operational Amplifier, 4 Func, 4000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 Operational Amplifier, 4 Func, 7000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 Operational Amplifier, 4 Func, 5000uV Offset-Max, BIPolar, 0.058 X 0.063 INCH, DIE-14 Operational Amplifier, 4 Func, 4000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 Operational Amplifier, 4 Func, 9000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 Operational Amplifier, 4 Func, 4000uV Offset-Max, BIPolar, 0.058 X 0.063 INCH, DIE-14 Operational Amplifier, 4 Func, 5000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14
Parts packaging code DIE DIP DFP DIP DIP DIE DIP DIP DIE DIP
package instruction 0.058 X 0.063 INCH, DIE-14 PLASTIC, TO-116, DIP-14 CERPACK-14 DIP, DIP14,.3 DIP, DIP14,.3 DIE, DIP, DIP, DIP14,.3 DIE, DIP,
Contacts 14 14 14 14 14 14 14 14 14 14
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Maximum average bias current (IIB) 0.3 µA 0.2 µA 0.1 µA 0.1 µA 0.3 µA 0.2 µA 0.1 µA 0.5 µA 0.1 µA 0.2 µA
Nominal Common Mode Rejection Ratio 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 70 dB 85 dB 85 dB
Maximum input offset voltage 7000 µV 5000 µV 4000 µV 4000 µV 7000 µV 5000 µV 4000 µV 9000 µV 4000 µV 5000 µV
JESD-30 code R-XUUC-N14 R-PDIP-T14 R-CDFP-F14 R-CDIP-T14 R-CDIP-T14 R-XUUC-N14 R-CDIP-T14 R-CDIP-T14 R-XUUC-N14 R-CDIP-T14
Number of functions 4 4 4 4 4 4 4 4 4 4
Number of terminals 14 14 14 14 14 14 14 14 14 14
Maximum operating temperature 125 °C 70 °C 125 °C 85 °C 85 °C 70 °C 125 °C 70 °C 125 °C 70 °C
Minimum operating temperature -55 °C - -55 °C -25 °C -25 °C - -55 °C - -55 °C -
Package body material UNSPECIFIED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIE DIP DFP DIP DIP DIE DIP DIP DIE DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form UNCASED CHIP IN-LINE FLATPACK IN-LINE IN-LINE UNCASED CHIP IN-LINE IN-LINE UNCASED CHIP IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 3 mA 3 mA 3 mA 3 mA 3 mA 3 mA 3 mA 3 mA 3 mA 3 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES NO NO YES NO NO YES NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level MILITARY COMMERCIAL MILITARY OTHER OTHER COMMERCIAL MILITARY COMMERCIAL MILITARY COMMERCIAL
Terminal form NO LEAD THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal location UPPER DUAL DUAL DUAL DUAL UPPER DUAL DUAL UPPER DUAL
Nominal Uniform Gain Bandwidth 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz
Maker - AMD - AMD AMD AMD AMD AMD AMD AMD
length - 19.304 mm 6.1595 mm 19.431 mm 19.431 mm - 19.431 mm 19.431 mm - 19.431 mm
Maximum seat height - 5.08 mm 2.032 mm 5.08 mm 5.08 mm - 5.08 mm 5.08 mm - 5.08 mm
Terminal pitch - 2.54 mm 1.27 mm 2.54 mm 2.54 mm - 2.54 mm 2.54 mm - 2.54 mm
width - 7.62 mm 6.35 mm 7.62 mm 7.62 mm - 7.62 mm 7.62 mm - 7.62 mm

Recommended Resources

CD4072 circuit

CCD analog output signal processing circuit diagram

Resistance measurement circuit with automatic calibration

Simple password electric lock

Resistance temperature transmitter

CNC constant current source

Look at this board, guys.
1. How to fix the electrolytic capacitor with glue 2. Why does the circuit board look dirty?...
小豆子来了 PCB Design
[NXP Rapid IoT Review] + NXP Rapid IoT Mobile App Test
[size=4] Following [url=https://en.eeworld.com/bbs/%E5%88%9D%E8%AF%86NXP%20Rapid%20IOT]https://en.eeworld.com/bbs/forum.php?mod=viewthread&tid=1065192&extra=[/url] and [url=https://en.eeworld.com/bbs/...
飞扬自我 RF/Wirelessly
Instructions on how to connect the DSP core using the simulator based on CCS
1. Connect the emulator to the DSP in debug mode. In debug mode, turn the DIP switch to 11111 and connect the emulator to the JTAG interface.In CCS, click View and then click Target Configurations.Rig...
Jacktang DSP and ARM Processors
EETALK: Do radio frequency beauty devices really work? A complete review of alternative radio frequency applications!
The editor accidentally opened some knowledge question and answer apps and discovered that radio frequency technology can be used in "radio frequency ablation surgery" and can also "anti-wrinkle and t...
EEWORLD社区 RF/Wirelessly
Xunwei-IMX6Q development board Android application test-AndroidStudio-recorder test
The supporting materials for this chapter are in the directory of "iTOP-i.MX6 development board data summary (excluding CD data)\06_iTOP-iMX6 development board Android application development environm...
遥寄山川 ARM Technology
[GD32L233C] + 2. Sort out some configuration issues
[i=s]This post was last edited by chrisrh on 2022-1-8 15:02[/i]1. First of all, the demo routine is compiled with keil5.26 . To use the demo routine directly, you must use at least keil5.25 or above;2...
chrisrh GD32 MCU
Shortcut:   E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components

  1. 1N914AT50A
  2. 1000-112-2101-P100
  3. 2200JA1G501A2EB
  4. GUS-SS4BLF-02-1430-JF
  5. JTL07RE-8-35P(386)
  6. OR2T15A-6S240I
  7. SMD-91-5045
  8. GUS-SS7B-03-2550-FB
  9. M1-M7
  10. PS100R_10
  11. MMBD914WS_R1_00001
  12. A3961WVA-19P-V0-BK-C4318D183

Popular Articles

  1. ST launches ST4SIM M2M GSMA-compliant eSIM chip for mass market
  2. Pfeiffer Vacuum builds new Silicon Valley Innovation Center to support future semiconductor industry development
  3. Chip shortage leads to tight supply of financial industry, banks and credit cards
  4. Honor Mobile Phones Launches Free Extended Warranty Service for New Users
  5. The multimeter needle cannot be adjusted to zero
  6. LOTO Oscilloscope Software Function Demonstration - I²C Decoding
  7. Three great ways to reduce audible noise in motion control applications
  8. Infineon AURIX™ TC3xx, TC4x, TRAVEO™ T2G and PSoC microcontroller families support Rust language
  9. A brief discussion on arbitrary waveform generator and channel merging function
  10. Analysis of Functional Safety Solutions for Autonomous Driving Systems

Technical ResourceMore

  1. Changhong c2591/C2592 circuit diagram
  2. Matlab6.5 auxiliary system and development design
  3. TVS is a better ESD solution than varistors
  4. OTG host delays NAK processing (source code included)
  5. 8051 series microcontroller
  6. Design and implementation of navigation receiver based on CBOC signal
  7. TI training Stellaris LaunchPad introductory lecture 2 material download
  8. Frequency conversion speed regulation application technology 02
  9. The design and implementation of the 16QAM modulation side demodulation interface, focusing on several key parts of the design
  10. Analysis of the relationship between bit error rate BER and signal-to-noise ratio SNR ()

ForumMore

  1. [NXP Rapid IoT Review] + NXP Rapid IoT Mobile App Test
  2. Instructions on how to connect the DSP core using the simulator based on CCS
  3. EETALK: Do radio frequency beauty devices really work? A complete review of alternative radio frequency applications!
  4. Xunwei-IMX6Q development board Android application test-AndroidStudio-recorder test
  5. [GD32L233C] + 2. Sort out some configuration issues
  6. How to Make DSP Digital Oscillator Generate Phase-Shifted Sine Wave
  7. Unboxing Review (Part 3) Preliminary Understanding
  8. (Awards have been awarded) "Say hello" and get a gift: Comparing stm32cubemx, let's get to know the domestically produced Fudan Micro Cube MFANG
  9. STM32F10 Chinese reference material
  10. Showing my products + my development board

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号