TPC5663NND03 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> TPC5663NND03

Preview

TPC5663NND03: DescriptionNPN transistor; CategoryDiscrete semiconductor; File Size570KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

TPC5663NND03 Overview

NPN transistor

Features

Product Name: NPN Transistor

Product model: TPC5663NND03

Product parameters:

Pcm (maximum dissipated power): 150mW

Ic (collector current): 500mA

BVcbo (Collector-Base Breakdown Voltage): 15V

BVceo (Collector-Emitter Breakdown Voltage): 12V

BVebo (emitter-base breakdown voltage): 6V

hFE (current gain): Min: 270, Max: 680

VCE (sat) saturation voltage drop: 0.25V

fT (transition frequency): 320+MHz

Package: WBFBP-03B

TPC5663NND03 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

WBFBP-03B Plastic-Encapsulate Transistors

TPC5663NND03

TRANSISTOR

WBFBP-03B

(1.2×1.2×0.5)

unit: mm

TOP

DESCRIPTION

NPN Epitaxial planar Silicon Transistor

FEATURES

Collector saturation voltage is low.

(sat)

≤250mA

At I

=200mA / I

=10mA

APPLICATION

For switching For muting

For portable equipment:(i.e. Mobile phone,MP3, MD,CD-ROM,

DVD-ROM, Note book PC, etc.)

MARKING: BX

1. BASE

2. EMITTER

3. COLLECTOR

BACK

B E

MAXIMUM RATINGS(T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector Dissipation

Junction Temperature

Storage Temperature

Value

0.5

0.15

150

-55~150

Unit

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Collector-emitter saturation voltage

Transition frequency

Output capacitance

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

CE(sat

)

Test conditions

= 10μA, I

= 1mA , I

= 10μA, I

=15V, I

=6V, I

=2V, I

=10mA

=200mA, I

=10mA

=2V, I

=10mA,

f=100MHz

=10V, I

=0,f=1MHz

320

7.5

270

Min

0.1

680

0.25

MHz

Typ

Max

Unit

μA

A,May,2011

Recommended Resources

Light switch circuit with luminous indicator

Using VR to adjust bias voltage circuit diagram

Regulated current source circuit

Two range RF power meter

Circuit diagram to prevent outside calls

Microwave automatic lamp I

Dual-machine piezoelectric strapdown inertial navigation system based on MCU and DSP: 1 System Hardware DesignThe whole piezoelectric strapdown inertial navigation system is divided into three parts: piezoelectric inertial combination part; signal interface and analog-to-digital conver...; Aguilera Microcontroller MCU

Learn how to get started with embedded systems.: Personally, I think it depends on personal interest, whether you want to develop in the software direction or the hardware direction. If you want to develop in the software direction, I suggest you fi...; 6294316 Embedded System

[AT-START-F403A Evaluation] Part 1 FreeRTOS System IAR Environment Construction: I had some knowledge of Arteli's products through a friend's recommendation a year ago. My current project is coming to an end, and I have started many evaluations for the new project. The evaluation ...; uuxz99 Domestic Chip Exchange

Things you have to know about FPGA: FPGA (Field Programmable Gate Array) is translated into Chinese as: Field Programmable Gate Array, which is an integrated circuit in which designers can program customizable digital logic on site.1Wha...; 中信华 PCB Design

STM32CubeIDE imports the STM32 project automatically generated by Gizwits Online (based on the MDK environment: Recently, I have been trying to connect an STM32 device based on Gizwits IoT cloud platform . The development board I used was the STM32 minimum system evaluation board (based on STM32F103C8T6) purcha...; z3512641347 stm32/stm8

Clear (set) CCS5.5 eclipse workspace record: When using eclipse for development, you must first select a workspace. Some workspaces are no longer used, but they are always in the way when switching workspaces. How can I clear them? Find this fil...; 火辣西米秀 Microcontroller MCU

Popular Components