SD630CS datasheet, PDF - EEWORLD Datasheet

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SD630CS: DescriptionSchottky diodes; CategoryDiscrete semiconductor diode; File Size120KB，3 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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SD630CS Overview

Schottky diodes

Features

Product Name: Schottky Diode

Product model: SD630CS

parameter:

Repetitive reverse voltage peak Vrrm: 30V

Maximum average rectified current Io: 6A

Maximum forward surge current I FSM: 75A

Forward voltage drop VF: 0.55V when IF=3A

Maximum feedback current IR: 200uA when VR=30V

Package: TO-252/DPAK

SD630CS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	TO-252
package instruction	ROHS COMPLIANT, PLASTIC, DPAK-3
Contacts	3
Reach Compliance Code	_compli
ECCN code	EAR99
Other features	FREE WHEELING DIODE, LOW POWER LOSS
application	EFFICIENCY
Shell connection	CATHODE
Configuration	COMMON CATHODE, 2 ELEMENTS
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
Maximum forward voltage (VF)	0.55 V
JEDEC-95 code	TO-252
JESD-30 code	R-PSSO-G2
Maximum non-repetitive peak forward current	75 A
Number of components	2
Phase	1
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Maximum output current	6 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	30 V
surface mount	YES
technology	SCHOTTKY
Terminal form	GULL WING
Terminal location	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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SD620CS~SD660CS

SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS

20 to 60 Volts

CURRENT

6.0 Amperes

VOLTAGE

FEATURES

• Plastic package has Underwriters Laboratory Flammability

Classification 94V-O

• For surface mounted applications

• Low profile package

• Built-in strain relief

• Low power loss, High efficiency

• High surge capacity

• For use in low voltage high frequency inverters, free wheeling, and

polarity protection applications

• High temperature soldering guaranteed:260

C/10 seconds at terminals

• In compliance with EU RoHS 2002/95/EC directives

MECHANICALDATA

• Case: D PAK/TO-252 molded plastic

• Terminals: Solder plated, solderable per MIL-STD-750,Method 2026

• Polarity: As marking

• Standard packaging: 16mm tape (EIA-481)

• Weight: 0.0104 ounces, 0.297 grams.

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

PA RA M E TE R

M a xi m um R e c ur r e nt P e a k R e ve r s e V o l t a g e

M a xi m um R M S V o l t a g e

M a xi m um D C B l o c k i ng V o l t a g e

M a xi m um A ve r a g e F o r w a r d C ur r e nt a t Tc = 7 5

P e a k F o r w a r d S ur g e C ur r e nt : 8 . 3 m s s i ng l e ha l f s i ne - w a ve

s up e r i m p o s e d o n r a t e d l o a d ( J E D E C m e t ho d )

M a xi m um F o r w a r d V o l t a g e a t 3 . 0 A p e r l e g

M a xi m um D C R e ve r s e C ur r e nt T

= 2 5

a t R a t e d D C B l o c k i ng Vo l t a g e T

= 1 0 0

Ty p i c a l T h e r m a l R e s i s t a n c e

O p e r a t i n g J u n c t i o n Te m p e r a t u r e R a n g e

S t o r a g e Te m p e r a t u r e R a n g e

S YM B O L

S D 6 2 0 C S S D 6 3 0 C S S D 6 4 0 C S S D 6 5 0 C S S D 6 6 0 C S

RRM

RSM

D C

F ( A V )

F S M

J C

S TG

-5 5 to +1 2 5

0 .5 5

0 .2

-5 5 to +1 5 0

6 .0

0 .7

0 .1

U N IT S

C / W

Note: Both Bonding and Chip structure are available.

STAD-APR.27.2009

PAGE . 1

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