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SB820FCT

Description
Schottky diodes
CategoryDiscrete semiconductor    diode   
File Size190KB,2 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

Download Datasheet Parametric View All

SB820FCT Overview

Schottky diodes

Features

Product Name: Schottky Diode


Product model: SB820FCT


parameter:


Repetitive reverse voltage peak Vrrm: 20V


Maximum average rectified current Io: 8A


Maximum forward surge current I FSM: 150A


Forward voltage drop VF: 0.55V when IF=4A


Maximum feedback current IR: 200uA when VR=20V


Package: ITO-220AB


SB820FCT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
Parts packaging codeTO-220AB
package instructionROHS COMPLIANT, PLASTIC, ITO-220AB, 3 PIN
Contacts3
Reach Compliance Code_compli
ECCN codeEAR99
Other featuresFREE WHEELING DIODE, LOW POWER LOSS
applicationEFFICIENCY
Shell connectionISOLATED
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.55 V
JEDEC-95 codeTO-220AB
JESD-30 codeR-PSFM-T3
Maximum non-repetitive peak forward current150 A
Number of components2
Phase1
Number of terminals3
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Maximum output current8 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage20 V
surface mountNO
technologySCHOTTKY
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED

SB820FCT Preview

Download Datasheet
SB820FCT SERIES
SCHOTTKY BARRIER RECTIFIER
VOLTAGE
FEATURES
0.112(2.85)
0.100(2.55)
0.272(6.9)
0.248(6.3)
20 to 60 Volts
CURRENT
8 Amperes
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• In compliance with EU RoHS 2002/95/EC directives
0.406(10.3)
0.381(9.7)
0.134(3.4)
0.118(3.0)
0.189(4.8)
0.165(4.2)
0.130(3.3)
0.114(2.9)
0.606(15.4)
0.583(14.8)
MECHANICAL DATA
• Case: ITO-220AB full molded plastic package
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Mounting Position: Any
• Weight: 0.055 ounces, 1.5615 grams.
0.055(1.4)
0.039(1.0)
0.055(1.4)
0.039(1.0)
0.028(0.7)
0.019(0.5)
0.100(2.55)
0.177(4.5)
0.137(3.5)
0.543(13.8)
0.512(13.0)
0.114(2.9)
0.098(2.5)
0.100(2.55)
0.027(0.67)
0.022(0.57)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA ME TE R
Ma xi mum Re c urre nt P e a k Re ve rs e Vo lta g e
Ma xi mum RMS Vo lta g e
Ma xi mum D C B lo c k i ng Vo lta g e
Ma xi mum A ve ra g e F o rwa rd C urre nt a t T
C
=7 5
O
C
P e a k F o rwa r d S urg e C urre nt : 8 .3 ms si ng le ha lf s i ne - wa ve
s up e ri mp o se d o n ra te d lo a d (J E D E C me tho d )
Ma xi mum F o r wa rd Vo lta g e a t 4 .0 A
Ma xi mum D C Re ve rs e C urre nt a t Ra te d D C
B lo c k i ng Vo lta g e
Typ i ca l The r ma l Re si s ta nce
Op e ra ti ng J unc ti o n Te mp e ra ture Ra ng e
S to ra g e Te mp e r ature Ra ng e
T
J
=2 5
O
C
T
J
=1 0 0
O
C
S YMB OL
V
RRM
V
RMS
V
R
I
F (AV )
I
F S M
V
F
I
R
R
θ
JC
T
J
T
S TG
S B 8 2 0 F C T S B 8 3 0 F C T S B 8 4 0 F C T S B 8 4 5 F C T S B 8 5 0 F C T S B 8 6 0 F C T
UNITS
20
14
20
30
21
30
40
28
40
8
150
0 .5 5
45
31
45
50
35
50
60
42
60
V
V
V
A
A
0 .7 5
0 .1
50
3
O
V
0 .2
50
mA
C / W
O
- 55 to +1 2 5
-5 5 to +1 5 0
-5 5 to +1 5 0
C
C
O
NOTES:
Both Bonding and Chip structure are available.
May 30.2011-REV.04
PAGE . 1
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